
General Description
The MAX2240 single-supply, low-voltage power amplifi-
er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com-
pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro-
vides a nominal +20dBm (100mW) output power in the
highest power mode.
The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con-
trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut-
down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5μA.
The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup-
ply-independent biasing are also included to provide
stable performance under all operating conditions.
The IC operates from a +2.7V to +5V single-supply volt-
age. No negative bias voltage is required. Current con-
sumption is a modest 105mA at the highest power
level.
The part is packaged in the ultra-chipscale package
(UCSP), significantly reducing the required PC board
area. The chip occupies only a 1.56mm x 1.56mm area.
The 3 x 3 array of solder bumps are spaced with a
0.5mm bump pitch.
________________________Applications
Bluetooth
HomeRF
802.11 FHSS WLAN
2.4GHz ISM Proprietary Radios
Features
o
2.4GHz to 2.5GHz Frequency Range
o
High +20dBm Output Power
o
2-Bit Digital Power Control: 4 Output Levels
o
Integrated Input Match to 50
o
Low 105mA Operating Current
o
0.5μA Low-Power Shutdown Mode Current
o
+2.7V to +5V Single-Supply Operation
o
Ultra-Chipscale Package
(1.56mm x 1.56mm)
M
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
________________________________________________________________
Maxim Integrated Products
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
1
MATCH
L
220 pF
BIAS
18pF
1.2nH* (BOARD TRACE)
V
CC
D0
D1
SHDN
RFIN
GND1
GND2
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE
(SEE
APPLICATIONS
SECTION).
RFOUT
RFOUT
22nH
10pF
65
θ
= 41
°
75
θ
= 26
°
V
CC
V
CC
V
CC
BIAS &
POWER
CONTROL
Typical Application Circuit/Functional Diagram
19-1624; Rev 0; 3/00
EVALUATION KIT MANUAL
Ordering Information
9 UCSP*
PIN-PACKAGE
TEMP. RANGE
-40°C to +85°C
MAX2240EBL
PART
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
Pin Configuration appears at end of data sheet.
FOLLOWS DATA SHEET