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參數資料
| 型號： | MAX6626RMTT+T |
| 廠商： | Maxim Integrated |
| 文件頁數： | 2/14頁 |
| 文件大小： | 421K |
| 描述： | IC TEMP SENSOR I2C 6-TDFN |
| 產品培訓模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標準包裝： | 2,500 |
| 功能： | 溫度監控系統（傳感器） |
| 傳感器類型： | 內部 |
| 感應溫度： | -55°C ~ 125°C |
| 精確度： | ±1°C（最小值） |
| 拓撲： | ADC，比較器，寄存器庫 |
| 輸出類型： | I²C?/SMBus? |
| 輸出警報： | 是 |
| 輸出風扇： | 是 |
| 電源電壓： | 3 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-WDFN 裸露焊盤 |
| 供應商設備封裝： | 6-TDFN 裸露焊盤（3x3） |
| 包裝： | 帶卷 (TR) |
MAX6625/MAX6626
9-Bit/12-Bit Temperature Sensors with
I
2
C-Compatible Serial Interface in a SOT23
2
Maxim Integrated
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(+3V d V
S
d +5.5V, T
A =
-55癈 to +125癈, unless otherwise noted.)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
S
to GND ................................................................-0.3V to +6V
OT, SCL, SDA to GND..............................................-0.3V to +6V
ADD to GND .................................................-0.3V to (V
S
+ 0.3V)
Current into Any Pin............................................................?mA
OT Sink Current.................................................................. 20mA
Continuous Power Dissipation
6-Pin SOT23 (derate 9.1mW/癈 above +70癈)............727mW
6-Pin TDFN (derate 23.8mW/癈 above +70癈) .........1905mW
Junction Temperature......................................................+150癈
Storage Temperature Range.............................-60癈 to +150癈
ESD Rating (Human Body Model)......................................2000V
Lead Temperature.............................................................Note 1
Note 1: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device
can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-
mended in the industry-standard specification, IPC/JEDEC J-STD-020A, paragraph 7.6, Table 3 for IR/VPR and Convection
Reflow. Preheating is required. Hand or wave soldering is not allowed.
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX UNITS
Power-Supply Voltage
V
S
3.0
5.5
V
I
2
C-compatible active
1
mA
I
2
C-compatible inactive
250
礎
Quiescent Current
I
C
Shutdown mode
1
礎
MAX6625
9
ADC Resolution
MAX6626
12
Bits
MAX6625
0.5
Temperature Resolution
MAX6626
0.0625
癈/LSB
T
A
= +25癈, V
S
= +3V to +3.6V
?
0癈 = T
A
d +50癈, V
S
= +3.0V to +3.6V
?.5
Accuracy (Notes 2, 3)
0癈 = T
A
d +70癈, V
S
= +3.0V to +3.6V
?.0
癈
Power-Supply Sensitivity
V
S
= +3V to +5.5V
1
癈/V
Conversion Time
t
C
133
ms
OT Pullup Resistor
R
P
MAX6625R, MAX6626R only
25
50
k&
OT Saturation Voltage (Note 4)
V
L
I
OUT
= 4mA (Note 4)
0.8
V
OT Delay
(Programmable through fault queue)
1 ?t
C
6 ?t
C
ms
T
HIGH
Default Temperature
T
HIGH
80
癈
T
LOW
Default Temperature
T
LOW
75
癈
I
2
C-COMPATIBLE I/O: SCL, SDA, ADD
V
S
< +3.6V
2
Input High Voltage
V
IH
V
S
> +3.6V
3
V
Input Low Voltage
V
IL
0.8
V
Input Hysteresis
0.2
V
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