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參數資料
| 型號： | MC14503BD |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | Full Featured -48V Hot Swap Power Manager, Industrial Temp. 14-TSSOP -40 to 85 |
| 中文描述： | 4000/14000/40000 SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16 |
| 封裝： | SOIC-16 |
| 文件頁數： | 7/8頁 |
| 文件大小： | 185K |
| 代理商： | MC14503BD |
MC14503B
http://onsemi.com
7
PACKAGE DIMENSIONS
H
E
A
1
DIM
A
MIN
–––
0.05
0.35
0.18
9.90
5.10
1.27 BSC
7.40
0.50
1.10
0
0.70
–––
MAX
2.05
0.20
0.50
0.27
10.50
5.45
MIN
–––
0.002
0.014
0.007
0.390
0.201
0.050 BSC
0.291
0.020
0.043
0
MAX
0.081
0.008
0.020
0.011
0.413
0.215
INCHES
MILLIMETERS
8.20
0.85
1.50
10
0.323
0.033
0.059
10
0.90
0.78
0.028
–––
0.035
0.031
A
1
b
c
D
E
e
H
E
L
Q
1
Z
L
E
M
L
E
Q
1
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4.
TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5.
THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUMMATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUMSPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16
9
8
D
Z
E
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
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