欧美成人免费电影,国产欧美一区二区三区精品酒店,精品国产a毛片,色网在线免费观看

參數資料
型號: MC33461SQ-32CTR
廠商: ON SEMICONDUCTOR
元件分類: 電源管理
英文描述: SCREW MACHINE PHIL 6-32X1/4 SS
中文描述: 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO4
封裝: PLASTIC, SC-82AB, 4 PIN
文件頁數: 11/12頁
文件大小: 256K
代理商: MC33461SQ-32CTR
MC33460, MC33461
http://onsemi.com
11
INFORMATION FOR USING THE SC–82AB SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
mm
1.90
0.80
1.30
0.80
SC–82AB
0.60
0.60
0.60
0.80
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
°
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10
°
C.
The soldering temperature and time shall not exceed
260
°
C for more than 10 seconds.
When shifting from preheating to soldering, the
maximum temperature gradient shall be 5
°
C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied
during cooling.
* Soldering a device without preheating can cause
excessive thermal shock and stress which can result in
damage to the device.
相關PDF資料
PDF描述
MC33461SQ-43CTR Under Voltage Detector Series
MC33461SQ-45CTR Under Voltage Detector Series
MC33463H-30KT1 VARIABLE FREQUENCY MICROPOWER DC-to-DC CONVERTER
MC33463H-50KT1 VARIABLE FREQUENCY MICROPOWER DC-to-DC CONVERTER
MC33463H-33LT1 VARIABLE FREQUENCY MICROPOWER DC-to-DC CONVERTER
相關代理商/技術參數
參數描述
MC33463H-30KT1 制造商:ON Semiconductor 功能描述: 制造商:Motorola Inc 功能描述:
MC33463H-30LT1 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC33463H-50KT1 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC33464H-20CT1 制造商:Rochester Electronics LLC 功能描述:- Bulk
MC33464H-27AT1 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
主站蜘蛛池模板: 广州市| 科尔| 平乐县| 宁南县| 泰和县| 封丘县| 彝良县| 乐东| 防城港市| 安义县| 正蓝旗| 谢通门县| 濮阳县| 盘锦市| 汉中市| 安义县| 罗定市| 绍兴县| 新田县| 泾源县| 永吉县| 秭归县| 尼勒克县| 武川县| 永定县| 漯河市| 塔河县| 霞浦县| 通州市| 化德县| 民丰县| 赤城县| 拉孜县| 长武县| 广州市| 天气| 义马市| 襄垣县| 三亚市| 阜平县| 昭通市|