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參數(shù)資料
| 型號： | MC33794 |
| 廠商： | Motorola, Inc. |
| 英文描述： | Electric Field Imaging Device |
| 中文描述： | 電場成像設(shè)備 |
| 文件頁數(shù)： | 18/20頁 |
| 文件大小： | 491K |
| 代理商： | MC33794 |
33794
18
MOTOROLA ANALOG INTEGRATED CIRCUIT DEVICE DATA
DWB SUFFIX
54-LEAD SOICW-EP
PLASTIC PACKAGE
CASE 1390-01
ISSUE B
NOTES:
1.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
DATUMS B AND C TO BE DETERMINED AT THE PLANE
WHERE THE BOTTOM OF THE LEADS EXIT THE
PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE MOLD FLASH,
PROTRUSION OR GATE BURRS. MOLD FLASH,
PROTRUSION OR GATE BURRS SHALL NOT EXCEED
0.15 MM PER SIDE. THIS DIMENSION IS DETERMINED
AT THE PLANE WHERE THE BOTTOM OF THE LEADS
EXIT THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSIONS. INTERLEAD FLASH AND
PROTRUSIONS SHALL NOT EXCEED 0.25 MM PER
SIDE. THIS DIMENSION IS DETERMINED AT THE
PLANE WHERE THE BOTTOM OF THE LEADS EXIT
THE PLASTIC BODY.
THIS DIMENSION DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED
0.46 MM. DAMBAR CANNOT BE LOCATED ON THE
LOWER RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD
SHALL NOT LESS THAN 0.07 MM.
EXACT SHAPE OF EACH CORNER IS OPTIONAL.
THESE DIMENSIONS APPLY TO THE FLAT SECTION
OF THE LEAD BETWEEN 0.1 MM AND 0.3 MM FROM
THE LEAD TIP.
THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM. THIS DIMENSION IS
DETERMINED AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH,
TIE BAR BURRS, GATE BURRS AND INTER-LEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN
THE TOP AND BOTTOM OF THE PLASTIC BODY.
3.
4.
5.
6.
7.
8.
9.
C
17.8
7.4
1
27
28
54
0.10
A
2.35
SEATING
0.9
0.5
SECTION B-B
0.65
R0.08 MIN
B
A
(0.29)
0.38
0.22
0.30
0.25
(0.25)
PLATING
BASE METAL
ROTATED 90 CLOCKWISE
8
9
5
0.13
M
C
A B
6
A
C
7.6
18.0
9
4
10.3
5.15
A
54X
52X
2.65
0.3
A
2X 27 TIPS
B
C
B
B
0.1
0.0
0
°
8
°
0
°
0.25
GAUGE PLANE
MIN
PIN 1 INDEX
C
C
(1.43)
4.8
4.3
0.30
C
A B
4.8
4.3
0.30
C
A B
VIEW C-C
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC33794DH | Electric Field Imaging Device |
| MC33794DWB | Electric Field Imaging Device |
| MC3392DW | LOW SIDE PROTECTED SWITCH |
| MC3392 | LOW SIDE PROTECTED SWITCH |
| MC3392T | LOW SIDE PROTECTED SWITCH |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC33794DH | 功能描述:IC SENSOR ELECTRIC FIELD 44-HSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794DHR2 | 制造商:Rochester Electronics LLC 功能描述:OCCUPANT DETECT E-FIELD SENSOR FOR MCU SUPPORT - Bulk |
| MC33794DWB | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794DWBR2 | 功能描述:IC SENSOR ELECTRIC FIELD 54-SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 傳感器和探測器接口 系列:- 其它有關(guān)文件:Automotive Product Guide 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 類型:觸控式傳感器 輸入類型:數(shù)字 輸出類型:數(shù)字 接口:JTAG，串行 電流 - 電源:100µA 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 |
| MC33794EK | 功能描述:近程傳感器 ODS 54LD RoHS:否 制造商:Vishay Semiconductors 感應(yīng)方式:Optical 感應(yīng)距離:1 mm to 200 mm 電源電壓:2.5 V to 3.6 V 安裝風(fēng)格:SMD/SMT 輸出配置:Digital 最大工作溫度:+ 85 C 最小工作溫度:- 25 C 系列:VCNL3020 |
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