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參數資料
| 型號： | MC34280FTBR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電源管理 |
| 英文描述： | Power Supply & Management IC for Handheld Electronic Products |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, PQFP32 |
| 封裝： | LQFP-32 |
| 文件頁數： | 17/20頁 |
| 文件大小： | 380K |
| 代理商： | MC34280FTBR2 |
MC34280
http://onsemi.com
17
PACKAGE DIMENSIONS
32–LEAD LQFP
FTB SUFFIX
CASE 873A–02
éé
éé
éé
J
DETAIL Y
A
S1
V
B
1
8
9
17
25
32
AE
AE
P
DETAIL Y
BASE
METAL
N
D
F
SECTION AE–AE
G
SPLANE
R
Q
W
K
X
0
G
E
C
H
DETAIL AD
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
3.
DATUMPLANE –AB– IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOMOF THE PARTING LINE.
4.
DATUMS –T–, –U–, AND –Z– TO BE
DETERMINED AT DATUMPLANE –AB–.
5.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE –AC–.
6.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE PROTRUSION
IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUMPLANE –AB–.
7.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
8.
MINIMUMSOLDER PLATE THICKNESS SHALL
BE 0.0076 (0.0003).
9.
EXACT SHAPE OF EACH CORNER MAY VARY
FROMDEPICTION.
DIM
A
A1
MIN
7.000 BSC
3.500 BSC
MAX
MIN
0.276 BSC
0.138 BSC
MAX
INCHES
MILLIMETERS
B
B1
7.000 BSC
3.500 BSC
0.276 BSC
0.138 BSC
C
D
E
F
G
H
J
K
M
N
P
Q
R
S
S1
1.400
0.300
1.350
0.300
0.800 BSC
0.050
0.090
0.500
12 REF
0.090
0.400 BSC
1
0.150
9.000 BSC
4.500 BSC
1.600
0.450
1.450
0.400
0.055
0.012
0.053
0.012
0.031 BSC
0.002
0.004
0.020
12 REF
0.004
0.016 BSC
1
0.006
0.354 BSC
0.177 BSC
0.063
0.018
0.057
0.016
0.150
0.200
0.700
0.006
0.008
0.028
0.160
0.006
5
5
0.250
0.010
V
V1
W
X
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
DETAIL AD
A1
B1
V1
4X
S
4X
9
–T–
–Z–
–U–
T–U
0.20 (0.008)
Z
AC
T–U
0.20 (0.008)
Z
AB
0.10 (0.004) AC
–AC–
–AB–
M
8X
–
T
M
0
Z
A
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