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參數(shù)資料
| 型號： | MC3S12GC32 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 16-Bit Microcontroller |
| 中文描述： | 16位微控制器 |
| 文件頁數(shù)： | 14/16頁 |
| 文件大小： | 520K |
| 代理商： | MC3S12GC32 |
MOTOROLA
14
MC9S12C-Family
Figure 11 52-pin LQFP Mechanical Dimensions (case no. 848D-03)
F
NOTES:
2.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: MILLIMETER
DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUMS -L-, -M- AND -N- TO BE DETERMINED AT
DATUM PLANE -H-.
DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -T-.
DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE LEAD WIDTH TO EXCEED 0.46 (0.018).
MINIMUM SPACE BETWEEN PROTRUSION AND
3.
4.
5.
6.
7.
8.
VIEW AA
AB
AB
VIEW Y
SECTION AB-AB
ROTATED 90
°
CLOCKWISE
DIM
A
A1
B
B1
C
C1
C2
D
E
F
G
J
K
R1
S
S1
U
V
V1
W
Z
θ
MIN
10.00 BSC
5.00 BSC
10.00 BSC
5.00 BSC
---
0.05
1.30
0.20
0.45
0.22
0.65 BSC
0.07
0.50 REF
0.08
12.00 BSC
6.00 BSC
0.09
12.00 BSC
6.00 BSC
0.20 REF
1.00 REF
0
0
°
MAX
MIN
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
---
0.002
0.051
0.008
0.018
MAX
INCHES
MILLIMETERS
1.70
0.20
1.50
0.40
0.75
0.067
0.008
0.059
0.016
0.030
0.014
0.35
0.009
0.026 BSC
0.003
0.020 REF
0.003
0.472 BSC
0.236 BSC
0.004
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
0
0
°
12
°
REF
12
°
REF
0.20
0.008
0.20
0.008
0.16
0.006
C
-X-
X=L, M, N
1
13
14
26
27
39
40
52
4X 13 TIPS
4X
N
0.20 (0.008) H L-M
N
0.20 (0.008) T L-M
SEATING
C
0.10 (0.004) T
4X
θ
3
4X
θ
2
S
0.05 (0.002)
0.25 (0.010)
GAGE PLANE
C2
C1
W
θ
1
K
E
Z
S
L-M
M
0.13 (0.005)
N
S
T
PLATING
BASE METAL
D
J
U
B
V
B1
A
S
V1
A1
S1
-L-
-N-
-M-
-H-
-T-
θ
G
θ
1
θ
2
θ
3
7
---
°
12
°
12
°
REF
7
---
°
REF
3X
VIEW Y
VIEW AA
2X R
R1
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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