- 您現在的位置：買賣IC網 > PDF目錄371038 > MC74HC04AN (ON SEMICONDUCTOR) CERAMIC CHIP/MIL-PRF-55681 PDF資料下載
參數資料
| 型號： | MC74HC04AN |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | HC/UH SERIES, HEX 1-INPUT INVERT GATE, PDIP14 |
| 封裝： | PLASTIC, DIP-14 |
| 文件頁數： | 6/7頁 |
| 文件大小： | 161K |
| 代理商： | MC74HC04AN |
MC54/74HC04A
MOTOROLA
High–Speed CMOS Logic Data
DL129 — Rev 6
6
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
4.90
4.30
–––
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
6.40 BSC
0
MAX
5.10
4.50
1.20
0.15
0.75
MIN
0.193
0.169
–––
0.002
0.020
0.026 BSC
0.020
0.004
0.004
0.007
0.007
0.252 BSC
0
MAX
0.200
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
0.60
0.20
0.16
0.30
0.25
0.024
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
ééé
ééé
ééé
SECTION N–N
DETAIL E
J J1
ééé
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U
0.15 (0.006) T
–V–
14X REF
N
N
相關PDF資料 |
PDF描述 |
|---|---|
| MC74HC04 | PNP Silicon Transistor; Package: TO-220; No of Pins: 3; Container: Bulk |
| MC74HC04ADT | CERAMIC CHIP/MIL-PRF-55681 |
| MC74HC04AN | CERAMIC CHIP/MIL-PRF-55681 |
| MC54HC04AJ | CERAMIC CHIP/MIL-PRF-55681 |
| MC74HC04 | CERAMIC CHIP/MIL-PRF-55681 |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MC74HC04AND | 制造商:Motorola Inc 功能描述: |
| MC74HC04ANG | 功能描述:變換器 2-6V CMOS Hex RoHS:否 制造商:NXP Semiconductors 電路數量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| MC74HC04J | 制造商:Motorola Inc 功能描述:IC,LOGIC GATE,HEX INVERTER,HC-CMOS,DIP,14PIN,CERAMIC |
| MC74HC04M | 制造商:Fairchild Semiconductor Corporation 功能描述: |
| MC74HC05ADG | 功能描述:變換器 IC HEX INV W OD OUT RoHS:否 制造商:NXP Semiconductors 電路數量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
發布緊急采購，3分鐘左右您將得到回復。