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參數資料
| 型號： | MC74HC365ADTR2G |
| 廠商： | ON Semiconductor |
| 文件頁數： | 1/8頁 |
| 文件大小： | 0K |
| 描述： | IC BUFFER NONINV HEX 3ST 16TSSOP |
| 標準包裝： | 2,500 |
| 系列： | 74HC |
| 邏輯類型： | 緩沖器/線路驅動器，非反相 |
| 元件數： | 1 |
| 每個元件的位元數： | 6 |
| 輸出電流高，低： | 7.8mA，7.8mA |
| 電源電壓： | 2 V ~ 6 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應商設備封裝： | 16-TSSOP |
| 包裝： | 帶卷 (TR) |
Semiconductor Components Industries, LLC, 2009
December, 2009 Rev. 2
1
Publication Order Number:
MC74HC365A/D
MC74HC365A
Hex 3-State Noninverting
Buffer with Common
Enables
HighPerformance SiliconGate CMOS
The MC74HC365A is identical in pinout to the LS365. The device
inputs are compatible with standard CMOS outputs; with pullup
resistors, they are compatible with LSTTL outputs.
This device is a highspeed hex buffer with 3state outputs and two
common activelow Output Enables. When either of the enables is
high, the buffer outputs are placed into highimpedance states. The
HC365A has noninverting outputs.
Features
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1.0 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 90 FETs or 22.5 Equivalent Gates
These are PbFree Devices*
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
MARKING
DIAGRAMS
SOIC16
D SUFFIX
CASE 751B
TSSOP16
DT SUFFIX
CASE 948F
1
16
PDIP16
N SUFFIX
CASE 648
1
16
1
16
1
16
MC74HC365AN
AWLYYWWG
1
16
HC365AG
AWLYWW
HC
365A
ALYWG
G
1
16
A
= Assembly Location
WL, L
= Wafer Lot
YY, Y
= Year
WW, W = Work Week
G or G
= PbFree Package
(Note: Microdot may be in either location)
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
相關PDF資料 |
PDF描述 |
|---|---|
| QMS07DH-N | FRONT PANEL 4TE |
| MC74HC365ADR2G | IC BUFFER NONINV HEX 3ST 16SOIC |
| QMS14DG | FRONT PANEL 4TE |
| QMS14DG-N | FRONT PANEL 5TE |
| MM74HC126MTC | IC BUFF TRI-ST QD N-INV 14TSSOP |
相關代理商/技術參數 |
參數描述 |
|---|---|
| MC74HC365AF | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74HC365N | 制造商:Motorola Inc 功能描述: 制造商:Texas Instruments 功能描述: |
| MC74HC367ADG | 功能描述:緩沖器和線路驅動器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74HC367ADR2G | 功能描述:緩沖器和線路驅動器 IC BUFF/DVR TRI-ST HEX RoHS:否 制造商:Micrel 輸入線路數量:1 輸出線路數量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74HC367ADT | 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
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