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參數(shù)資料
| 型號(hào)： | MC74HC4016ADT |
| 廠商： | MOTOROLA INC |
| 元件分類： | 運(yùn)動(dòng)控制電子 |
| 英文描述： | GaAs Infrared Emitting Diode; Package: TO-46 Diode Flat Lens; No of Pins: 2; Container: Bulk |
| 中文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO14 |
| 封裝： | PLASTIC, TSSOP-14 |
| 文件頁數(shù)： | 10/12頁 |
| 文件大小： | 334K |
| 代理商： | MC74HC4016ADT |
MC54/74HC4016A
MOTOROLA
High–Speed CMOS Logic Data
DL129 — Rev 6
3–10
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
MIN
0.750
0.245
0.155
0.015
0.055
0.100 BSC
MIN
19.05
6.23
3.94
0.39
1.40
2.54 BSC
MAX
0.785
0.280
0.200
0.020
0.065
MAX
19.94
7.11
5.08
0.50
1.65
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
J
K
L
M
N
0.015
0.170
15
°
0.040
0.008
0.125
0.300 BSC
0
°
0.020
0.38
4.31
15
°
1.01
0.21
3.18
7.62 BSC
0
°
0.51
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
14
8
1
7
-A-
-B-
-T-
SEATING
PLANE
F
G
N
K
C
L
M
0.25 (0.010)
T
A
M
S
0.25 (0.010)
T
B
M
S
J
14 PL
D
14 PL
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
1
7
14
8
B
A
F
H
G
D
K
C
N
L
J
M
SEATING
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MIN
0.715
0.240
0.145
0.015
0.040
0.100 BSC
0.052
0.008
0.115
0.300 BSC
0
0.015
MAX
0.770
0.260
0.185
0.021
0.070
MIN
18.16
6.10
3.69
0.38
1.02
MAX
19.56
6.60
4.69
0.53
1.78
MILLIMETERS
INCHES
2.54 BSC
1.32
0.20
2.92
7.62 BSC
0
0.39
0.095
0.015
0.135
2.41
0.38
3.43
10
10
1.01
0.039
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| MC74HC4016AN | GaAs Infrared Emitting Diode; Package: TO-46 Diode Convex Lens; No of Pins: 2; Container: Bulk |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
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