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參數(shù)資料
| 型號(hào)： | MC74HC74A |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Dual D Flip-Flop with Set and Reset |
| 中文描述： | 雙D觸發(fā)器的設(shè)置和復(fù)位 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 229K |
| 代理商： | MC74HC74A |
MC54/74HC74A
MOTOROLA
High–Speed CMOS Logic Data
DL129 — Rev 6
3–6
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
4.90
4.30
–––
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
6.40 BSC
0
MAX
5.10
4.50
1.20
0.15
0.75
MIN
0.193
0.169
–––
0.002
0.020
0.026 BSC
0.020
0.004
0.004
0.007
0.007
0.252 BSC
0
MAX
0.200
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
0.60
0.20
0.16
0.30
0.25
0.024
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
ééé
ééé
ééé
SECTION N–N
DETAIL E
J J1
ééé
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
H
G
A
D
C
B
S
U
0.15 (0.006) T
–V–
14X REF
N
N
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74HC74AD | 功能描述:觸發(fā)器 2-6V CMOS Dual RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74HC74ADG | 功能描述:觸發(fā)器 2-6V CMOS Dual D-Type w/Set Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74HC74ADR2 | 功能描述:觸發(fā)器 2-6V CMOS Dual RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74HC74ADR2G | 功能描述:觸發(fā)器 2-6V CMOS Dual D-Type w/Set Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74HC74ADR2G-CUT TAPE | 制造商:ON 功能描述:MC74HC74A Series 2 to 6 V Dual D-Type Flip-Flop with Set and Reset - SOIC-14 |
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