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參數(shù)資料
| 型號(hào)： | MC74LVX125M |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | LOW-VOLTAGE CMOS |
| 中文描述： | LV/LV-A/LVX/H SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 |
| 封裝： | EIAJ, SO-14 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 147K |
| 代理商： | MC74LVX125M |
MC74LVX125
LCX DATA
BR1339 — REV 3
5
MOTOROLA
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A
–
–B
–
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
Z
D
HE
E
1
14
8
7
b
A1
A
e
L
DIM
A
MIN
---
0.05
0.35
0.18
9.90
5.10
1.27 BSC
7.40
0.50
1.10
0
0.70
---
MAX
2.05
0.20
0.50
0.27
10.50
5.45
MIN
---
0.002
0.014
0.007
0.390
0.201
0.050 BSC
0.291
0.020
0.043
0
MAX
0.081
0.008
0.020
0.011
0.413
0.215
INCHES
MILLIMETERS
8.20
0.85
1.50
10
0.323
0.033
0.059
10
0.90
1.42
0.028
---
0.035
0.056
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
LE
Q1
c
M
VIEW P
DETAIL P
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4 TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5 THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005)
M
0.10 (0.004)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74LVX125MEL | 功能描述:緩沖器和線路驅(qū)動(dòng)器 2-3.6V Quad Bus RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74LVX125MELG | 功能描述:緩沖器和線路驅(qū)動(dòng)器 2-3.6V Quad Bus 3-State RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74LVX125MG | 功能描述:緩沖器和線路驅(qū)動(dòng)器 2-3.6V Quad Bus 3-State RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
| MC74LVX126D | 制造商:ON Semiconductor 功能描述:Buffer/Line Driver 4-CH Non-Inverting 3-ST CMOS 14-Pin SOIC Rail 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74LVX126M | 功能描述:緩沖器和線路驅(qū)動(dòng)器 2-3.6V Quad Bus RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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