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參數(shù)資料
| 型號： | MC74VHC374 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Octal D-Type Flip-Flop with 3-State Output |
| 中文描述： | 八路D類觸發(fā)器觸發(fā)器3態(tài)輸出 |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 177K |
| 代理商： | MC74VHC374 |
MC74VHC374
MOTOROLA
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
6
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC SOIC PACKAGE
CASE 751D–04
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
–A–
–B–
20
1
11
10
S
A
M
0.010 (0.25)
B
S
T
D
20X
M
B
M
0.010 (0.25)
P
10X
J
F
G
18X
K
C
–T–
SEATING
M
R
X 45
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
12.65
7.40
2.35
0.35
0.50
MAX
12.95
7.60
2.65
0.49
0.90
MIN
0.499
0.292
0.093
0.014
0.020
0.050 BSC
0.010
0.004
0
0.395
0.010
MAX
0.510
0.299
0.104
0.019
0.035
INCHES
MILLIMETERS
1.27 BSC
0.25
0.10
0
10.05
0.25
0.32
0.25
7
10.55
0.75
0.012
0.009
7
0.415
0.029
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948E–02
ISSUE A
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
6.40
MAX
6.60
4.50
1.20
0.15
0.75
MIN
0.252
MAX
0.260
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
4.30
–––
0.169
–––
0.05
0.50
0.65 BSC
0.27
0.09
0.09
0.19
0.19
6.40 BSC
0
0.002
0.020
0.026 BSC
0.011
0.004
0.004
0.007
0.007
0.252 BSC
0
0.37
0.20
0.16
0.30
0.25
0.015
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)
PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
íííí
íííí
íííí
SECTION N–N
1
10
11
20
PIN 1
IDENT
A
B
–T–
0.100 (0.004)
C
D
G
H
K
K1
J J1
N
N
M
F
–W–
SEATING
–V–
–U–
S
U
M
0.10 (0.004)
V
S
T
20X REF
L
L/2
2X
S
U
0.15 (0.006) T
DETAIL E
0.25 (0.010)
DETAIL E
S
U
0.15 (0.006) T
相關PDF資料 |
PDF描述 |
|---|---|
| MC74VHC374DT | Octal D-Type Flip-Flop with 3-State Output |
| MC74VHC374DW | Octal D-Type Flip-Flop with 3-State Output |
| MC74VHC374M | Octal D-Type Flip-Flop with 3-State Output |
| MC74VHC393 | Dual 4-Bit Binary Ripple Counter |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MC74VHC374DT | 制造商:ON Semiconductor 功能描述:Flip Flop D-Type Bus Interface Pos-Edge 3-ST 1-Element 20-Pin TSSOP Rail 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel |
| MC74VHC374DTR2 | 功能描述:觸發(fā)器 2-5.5V CMOS Octal RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74VHC374DTR2G | 功能描述:觸發(fā)器 2-5.5V CMOS Octal D-Type w/3-State Out RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74VHC374DWR2 | 功能描述:觸發(fā)器 2-5.5V CMOS Octal RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC74VHC374DWR2G | 功能描述:觸發(fā)器 2-5.5V CMOS Octal D-Type w/3-State Out RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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