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參數(shù)資料
| 型號： | MC74VHCT04A |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 電容 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | 陶瓷芯片/mil-prf-55681 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 130K |
| 代理商： | MC74VHCT04A |
MC74VHCT04A
MOTOROLA
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
4
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
4.90
4.30
–––
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
6.40 BSC
0
MAX
5.10
4.50
1.20
0.15
0.75
MIN
0.193
0.169
–––
0.002
0.020
0.026 BSC
0.020
0.004
0.004
0.007
0.007
0.252 BSC
0
MAX
0.200
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
0.60
0.20
0.16
0.30
0.25
0.024
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J J1
K
K1
ééé
ééé
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
H
G
A
D
C
B
S
U
0.15 (0.006) T
–V–
14X REF
N
N
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| MC74VHCT04AD | CERAMIC CHIP/MIL-PRF-55681 |
| MC74VHCT04ADT | CERAMIC CHIP/MIL-PRF-55681 |
| MC74VHCT04AM | CERAMIC CHIP/MIL-PRF-55681 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74VHCT04AD | 制造商:ON Semiconductor 功能描述:Inverter 6-Element CMOS 14-Pin SOIC N Rail 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC74VHCT04AD1P | 制造商:ON Semiconductor 功能描述: |
| MC74VHCT04ADR2 | 功能描述:變換器 5V CMOS Hex RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| MC74VHCT04ADR2G | 功能描述:變換器 5V CMOS Hex w/Schmitt Trigger RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| MC74VHCT04ADT | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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