- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄382316 > MC74VHCU04M (ON SEMICONDUCTOR) CERAMIC CHIP/MIL-PRF-55681 PDF資料下載
參數(shù)資料
| 型號： | MC74VHCU04M |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 通用總線功能 |
| 英文描述： | CERAMIC CHIP/MIL-PRF-55681 |
| 中文描述： | AHC/VHC SERIES, HEX 1-INPUT INVERT GATE, PDSO14 |
| 封裝： | EIAJ, SOIC-14 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大小： | 137K |
| 代理商： | MC74VHCU04M |
MC74VHCU04
MOTOROLA
VHC Data – Advanced CMOS Logic
DL203 — Rev 0
4
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
MIN
8.55
3.80
1.35
0.35
0.40
1.27 BSC
MIN
0.337
0.150
0.054
0.014
0.016
0.050 BSC
MAX
8.75
4.00
1.75
0.49
1.25
MAX
0.344
0.157
0.068
0.019
0.049
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
0.19
0.10
0
°
5.80
0.25
0.25
0.25
7
°
6.20
0.50
0.008
0.004
0
°
0.228
0.010
0.009
0.009
7
°
0.244
0.019
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
–B–
P
7 PL
G
C
K
SEATING
PLANE
D
14 PL
M
J
R
X 45
°
1
7
8
14
0.25 (0.010)
T
B
A
M
S
S
B
0.25 (0.010)
M
M
F
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MIN
4.90
4.30
–––
0.05
0.50
0.65 BSC
0.50
0.09
0.09
0.19
0.19
6.40 BSC
0
MAX
5.10
4.50
1.20
0.15
0.75
MIN
0.193
0.169
–––
0.002
0.020
0.026 BSC
0.020
0.004
0.004
0.007
0.007
0.252 BSC
0
MAX
0.200
0.177
0.047
0.006
0.030
INCHES
MILLIMETERS
0.60
0.20
0.16
0.30
0.25
0.024
0.008
0.006
0.012
0.010
8
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
S
U
0.15 (0.006) T
2X
L/2
S
U
M
0.10 (0.004)
V
S
T
L
–U–
SEATING
PLANE
0.10 (0.004)
–T–
SECTION N–N
DETAIL E
J J1
K
K1
ééé
ééé
DETAIL E
F
M
–W–
0.25 (0.010)
8
14
7
1
PIN 1
H
G
A
D
C
B
S
U
0.15 (0.006) T
–V–
14X REF
N
N
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MC74VHCU04D | CERAMIC CHIP/MIL-PRF-55681 |
| MC75174BDW | QUAD EIA-485 LINE DRIVERS |
| MC75174 | QUAD EIA-485 LINE DRIVERS |
| MC75174BP | QUAD EIA-485 LINE DRIVERS |
| MC75172B | QUAD EIA-485 LINE DRIVERS |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC74VHCU04MEL | 功能描述:變換器 2-5.5V CMOS Hex RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| MC74VHCU04MELG | 功能描述:變換器 2-5.5V CMOS Hex Unbuffered RoHS:否 制造商:NXP Semiconductors 電路數(shù)量:6 邏輯系列:74ABT 邏輯類型:BiCMOS 高電平輸出電流:- 15 mA 低電平輸出電流:20 mA 傳播延遲時間:2.2 ns 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 工作溫度范圍: 封裝 / 箱體:DIP-14 封裝:Tube |
| MC74VLX138D | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MC75 MODULE | 制造商:Siemens 功能描述:GSM/GPRS/EDGE MODULE & B2B |
| MC-750-427 | 制造商:Brady Corporation 功能描述:WIRE MARKER TAPE, 0.375"W X 0.75"H X 25'L; Marker Type:Self Laminating; Marker Dimensions:9.525mm x 19.05mm; Marker Material:Vinyl; Legend:Blank (No Legend); Legend Color:Black; Marker Color:White; Features:Clear Overlaminate Wrap ;RoHS Compliant: Yes |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。