欧美成人免费电影,国产欧美一区二区三区精品酒店,精品国产a毛片,色网在线免费观看

參數(shù)資料
型號(hào)： MCM63P636ZP200R
廠商： Motorola, Inc.
元件分類： 圓形連接器
英文描述： Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:5; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:18-5
中文描述： 64K的× 36位流水線BurstRAM同步快速靜態(tài)存儲(chǔ)器
文件頁(yè)數(shù)： 8/27頁(yè)
文件大小： 328K
代理商： MCM63P636ZP200R
MCM63P636
8
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS
(See Note 1)
Rating
Symbol
Value
Unit
Notes
Power Supply Voltage
VDD
VDDQ
VDDI
Vin
VSS – 0.5 to + 4.0
VSS – 0.5 to 2.5
VSS – 0.5 to 2.5
VSS – 0.5 to
VDDI + 0.5
V
I/O Supply Voltage
V
2, 3
Input Supply Voltage
V
2, 3
Voltage Relative to VSS for Any Pin
Except VDD
V
2, 4
Input Voltage (Three–State I/O)
VIT
VSS – 0.5 to
VDDQ + 0.5
V
2, 4
Output Current (per I/O)
Iout
PD
Tbias
Tstg
±
20
mA
Package Power Dissipation
2.75
W
5
Temperature Under Bias
– 10 to 85
°
C
Storage Temperature
– 55 to 125
°
C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. This is a steady–state DC parameter that is in effect after the power supply has
achieved its nominal operating level. Power sequencing is not necessary.
3. VDDI = VDDQ.
4. Max Vin and VIT are not to exceed Max VDD.
5. Power dissipation capability is dependent upon package characteristics and use
environment. See Package Thermal Characteristics.
PACKAGE THERMAL CHARACTERISTICS — PBGA
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 lfm)
R
θ
JA
R
θ
JB
R
θ
JC
25
°
C/W
1, 2
Junction to Board (Bottom)
12
°
C/W
3
Junction to Case (Top)
10
°
C/W
4
PACKAGE THERMAL CHARACTERISTICS — TQFP
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (@ 200 lfm)
R
θ
JA
R
θ
JB
R
θ
JC
25
°
C/W
1, 2
Junction to Board (Bottom)
17
°
C/W
3
Junction to Case (Top)
9
°
C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
相關(guān)PDF資料
PDF描述
MCM63P636ZP225 Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:5; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:18-5
MCM63P636ZP225R Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:5; Connector Shell Size:18; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:18-5
MCM63P636ZP250 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; Number of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
MCM63P636ZP250R Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:16; Connector Shell Size:20; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:20-16
MCM63P736ZP100 Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:41; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:22-41
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCM63P636ZP225 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:64K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM
MCM63P636ZP225R 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:64K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM
MCM63P636ZP250 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:64K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM
MCM63P636ZP250R 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:64K x 36 Bit Pipelined BurstRAM Synchronous Fast Static RAM
MCM63P733A 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:128K x 32 Bit Pipelined BurstRAM Synchronous Fast Static RAM
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*
主站蜘蛛池模板： 邹平县| 崇礼县| 托克逊县| 奉新县| 甘洛县| 上栗县| 成武县| 丽江市| 怀来县| 诸城市| 东兰县| 麦盖提县| 涞源县| 方城县| 陈巴尔虎旗| 云林县| 武隆县| 绥江县| 阜新| 荔浦县| 定日县| 张掖市| 应用必备| 上栗县| 宜宾市| 萨嘎县| 兰西县| 襄垣县| 宝应县| 龙里县| 岳阳市| 汉源县| 九龙县| 科技| 武定县| 平武县| 五大连池市| 罗定市| 邳州市| 衡水市| 怀集县|