欧美成人免费电影,国产欧美一区二区三区精品酒店,精品国产a毛片,色网在线免费观看

參數資料
型號: MCM69L738AZP9.5R
廠商: MOTOROLA INC
元件分類: DRAM
英文描述: Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:5; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-5
中文描述: 128K X 36 CACHE SRAM, 9.5 ns, PBGA119
封裝: 14 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-119
文件頁數: 5/20頁
文件大?。?/td> 212K
代理商: MCM69L738AZP9.5R
MCM69L738A
MCM69L820A
5
MOTOROLA FAST SRAM
ABSOLUTE MAXIMUM RATINGS
(Voltages Referenced to VSS, See Note 1)
Rating
Symbol
Value
Unit
Core Supply Voltage
VDD
– 0.5 to + 4.6
V
Output Supply Voltage
VDDQ
– 0.5 to VDD + 0.5
V
Voltage On Any Pin
Vin
– 0.5 to VDD + 0.5
V
Input Current (per I/O)
Iin
±
50
mA
Output Current (per I/O)
Iout
±
70
mA
Power Dissipation (See Note 2)
PD
W
Operating Temperature
TA
0 to + 70
°
C
Temperature Under Bias
Tbias
– 10 to + 85
°
C
Storage Temperature
Tstg
– 55 to + 125
°
C
NOTES:
1. Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER-
ATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
2. Power dissipation capability will be dependent upon package characteristics and use
environment. See enclosed thermal impedance data.
PBGA PACKAGE THERMAL CHARACTERISTICS
Rating
Symbol
Max
Unit
Notes
Junction to Ambient (Still Air)
R
θ
JA
R
θ
JA
R
θ
JA
R
θ
JB
R
θ
JC
53
°
C/W
1, 2
Junction to Ambient (@200 ft/min)
Single Layer Board
38
°
C/W
1, 2
Junction to Ambient (@200 ft/min)
Four Layer Board
22
°
C/W
Junction to Board (Bottom)
14
°
C/W
3
Junction to Case (Top)
5
°
C/W
4
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC–883
Method 1012.1).
CLOCK TRUTH TABLE
K CLK
ZZ
SS
SW
SBa
SBb
SBc
SBd
DQ (n)
DQ (n+1)
Mode
L – H
L
L
H
X
X
X
X
Dout 0–35
High–Z
X
Read Cycle All Bytes
L – H
L
L
L
L
H
H
H
Din 0–8
Din 9–17
Din 18–26
Din 27–35
Din 0–35
High–Z
Write Cycle 1st Byte
L – H
L
L
L
H
L
H
H
High–Z
Write Cycle 2nd Byte
L – H
L
L
L
H
H
L
H
High–Z
Write Cycle 3rd Byte
L – H
L
L
L
H
H
H
L
High–Z
Write Cycle 4th Byte
L – H
L
L
L
L
L
L
L
High–Z
Write Cycle All Bytes
L – H
L
L
L
H
H
H
H
High–Z
Abort Write Cycle
L – H
L
H
X
X
X
X
X
High–Z
X
Deselect Cycle
X
H
X
X
X
X
X
X
High–Z
High–Z
Sleep Mode
This device contains circuitry to protect the
inputs against damage due to high static volt-
ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi-
mum rated voltages to this high–impedance
circuit.
This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.
This device contains circuitry that will ensure
the output devices are in High–Z at power up.
相關PDF資料
PDF描述
MCM69L820AZP9.5R 4M Late Write 2.5 V I/O
MCM69L738AZP9R Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
MCM69L820AZP9R Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:6; Connector Shell Size:10; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket; Insert Arrangement:10-6
MCM69L738AZP8.5R Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:12; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:14-12
MCM69L820AZP8.5R Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:12; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle
相關代理商/技術參數
參數描述
MCM69L738AZP9R 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:4M Late Write 2.5 V I/O
MCM69L817 制造商:SIPEX 制造商全稱:Sipex Corporation 功能描述:S2ADC⑩ - Simultaneous Sampling Analog to Digital Converter
MCM69L817ZP6 制造商:SIPEX 制造商全稱:Sipex Corporation 功能描述:S2ADC⑩ - Simultaneous Sampling Analog to Digital Converter
MCM69L817ZP6.5 制造商:SIPEX 制造商全稱:Sipex Corporation 功能描述:S2ADC⑩ - Simultaneous Sampling Analog to Digital Converter
MCM69L817ZP6.5R 制造商:SIPEX 制造商全稱:Sipex Corporation 功能描述:S2ADC⑩ - Simultaneous Sampling Analog to Digital Converter
主站蜘蛛池模板: 平凉市| 大埔县| 游戏| 大荔县| 大港区| 德阳市| 新巴尔虎右旗| 游戏| 故城县| 宝坻区| 高雄县| 竹山县| 洱源县| 防城港市| 濉溪县| 花莲市| 广水市| 景洪市| 乐都县| 北宁市| 镇远县| 九龙城区| 福建省| 安西县| 丰宁| 巫溪县| 太湖县| 曲靖市| 临安市| 皮山县| 沧源| 湘潭县| 大港区| 邳州市| 辉县市| 二手房| 临城县| 喀喇沁旗| 高清| 桐庐县| 古交市|