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參數資料
| 型號： | MCR89-130D-1.27DSC |
| 廠商： | Hirose Electric USA, INC. |
| 英文描述： | Socket for Memory Module Board |
| 中文描述： | 對內存插座模塊局 |
| 文件頁數： | 1/4頁 |
| 文件大小： | 135K |
| 代理商： | MCR89-130D-1.27DSC |
D2
Socket for Memory Module Board
MCR89 Series
I
Features
1. High Reliability
This socket achieves high reliability in the horizontal
contact spring system.
2. Low Insertion Force
This socket prevents mis-insertion force in the preload
structure.
3. Easy Pattern Design
The dip contact through-hole diameter is only
0.5, and
simplifies the pattern design.
4. Miniature Type and High Density Mounting
The low profile with 6.2mm height from the board is
suitable for miniaturization of equipment. The 1.27mm pitch
between contacts assures mounting with high density.
5. Wide Effective Mounting Area
This socket is capable of widening the effective mounting
area on the module printed board, and secures retention
function by easy locking.
6. Easy Board Mounting
The fixing pins are arranged in the same alignment as the
contact, so as to easily install the connector in the board.
7. Accessories
Dust covers and jigs to remove the board are available.
Note 1: Includes temperature rise caused by current flow.
Note 2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range
and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation.
Designed in Miniature 2
Contacts with High
Precision Spring
FEM Design
Simulation
500A DC
500V DC / 1 minute
100mA
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours in each of the 3 directions.
96 hours at temperature of 40
and humidity of 90% to 95%
5 cycles under following condition;
Temperature : -55: 30 minutes
+5 to 35
: 5 minutes max.
85
: 30 minutes
15- to 30
5 minutes max.)
200 cycles
Manual soldering: 300
for 3 seconds
Rating
Operating Temperature Range: -30 to +85
(Note 1)
Operating Humidity Range: 40 to 80%
Current rating: 0.5A
Voltage rating: 125V AC
Storage Temperature Range: -10 to +60
(Note 2)
Storage Temperature Range: 40 to 70% (Note 2)
1000M
ohms
min.
No flashover or insulation breakdown.
20m
ohms
max.
No electrical discontinuity of 10 μs or more
Insulation Resistance:1000M
ohms
min.
No damage, cracks, or parts looseness.
Contact resistance: 20m
ohms
max.
No deformation of components affecting performance.
1.
Contact Resistance
2.
Withstanding voltage
3.
Insulation Resistance
4. Vibration
5.
Humidity (Steady state)
6.
Temperature Cycle
7.
Durability (Insertion/withdrawal)
8.
Resistance to Soldering heat
Item
Specification
Conditions
I
Product Specifications
相關PDF資料 |
PDF描述 |
|---|---|
| MCR89-130D-DC | Socket for Memory Module Board |
| MCR89-130D-EJ | Socket for Memory Module Board |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MCR89-130D-DC | 制造商:HRS 制造商全稱:HRS 功能描述:Socket for Memory Module Board |
| MCR89-130D-EJ | 制造商:HRS 制造商全稱:HRS 功能描述:Socket for Memory Module Board |
| MCR8DCM | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Silicon Controlled Rectifiers |
| MCR8DCMT4 | 功能描述:SCR 600V 8A RoHS:否 制造商:STMicroelectronics 最大轉折電流 IBO:480 A 額定重復關閉狀態電壓 VDRM:600 V 關閉狀態漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態 RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
| MCR8DCMT4G | 功能描述:SCR 600V 8A RoHS:否 制造商:STMicroelectronics 最大轉折電流 IBO:480 A 額定重復關閉狀態電壓 VDRM:600 V 關閉狀態漏泄電流（在 VDRM IDRM 下）:5 uA 開啟狀態 RMS 電流 (It RMS): 正向電壓下降:1.6 V 柵觸發電壓 (Vgt):1.3 V 最大柵極峰值反向電壓:5 V 柵觸發電流 (Igt):35 mA 保持電流（Ih 最大值）:75 mA 安裝風格:Through Hole 封裝 / 箱體:TO-220 封裝:Tube |
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