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參數資料
| 型號： | MCZ34653EFR2 |
| 廠商： | Freescale Semiconductor |
| 文件頁數： | 4/24頁 |
| 文件大小： | 1649K |
| 描述： | IC HOTSWAP CTRLR 1A NEG 8-SOIC |
| 標準包裝： | 2,500 |
| 類型： | 熱交換開關 |
| 應用： | 通用 |
| 內部開關： | 是 |
| 電流限制： | 1A |
| 電源電壓： | 36 V ~ 80 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SOICN |
| 包裝： | 帶卷 (TR) |
Analog Integrated Circuit Device Data
4
Freescale Semiconductor
34653
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
rchived by Freescale Semiconductor, Inc., 2008
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
V
PWR
85
V
Power MOSFET Energy Capability
E
MOSFET
Varies
(1)
mJ
Continuous Output Current
(2)
I
O
(CONT
)
1.0
A
Maximum Voltage
DISABLE Pin
ILIM and ICHG Pins
PG Pin (V
PG
- V
IN
)
PG
Pin (V
PG
- V
IN
)
V
IN
- 0.3 to V
PWR
+ 5.5
5.0
85
85
V
All Pins Minimum Voltage
- 0.3
V
PG, PG
Maximum Current
Internally Limited
A
ESD Voltage, All Pins
(3)
Human Body Model
Machine Model
V
ESD3
V
ESD4
?2000
?200
V
THERMAL RATINGS
Storage Temperature
T
STG
- 65 to 150
癈
Operating Temperature
Ambient
(4)
Junction
T
A
T
J
- 40 to 85
- 40 to 160
癈
Peak Package Reflow Temperature During Reflow
(5)
,
(6)
T
PPRT
Note 6
癈
Thermal Resistance
(7)
,
(8)
Junction-to-Ambient, Single-Layer Board
(9)
Junction-to-Ambient, Four-Layer Board
(10)
R
窲A
R
窲MA
167
115
癈/W
Notes
1. Refer to the section titled Power MOSFET Energy Capability on page 21 for a detailed explanation on this parameter.
2. Continuous output current capability so long as T
J
is d 160?/SPAN>C.
3. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500 ?, ESD2 testing is performed in
accordance with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0 ?.
4. The limiting factor is junction temperature, taking into account power dissipation, thermal resistance, and heatsinking.
5. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6. Freescales Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL),
Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e.
MC33xxxD enter 33xxx), and review parametrics.
7. Refer to the section titled Thermal Shutdown on page 15 for more thermal resistance values under various conditions.
8. The VOUT and VIN pins comprise the main heat conduction paths.
9. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
10. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. There are no thermal vias connecting the package to the two planes in the
board.
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