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參數(shù)資料
型號(hào): MDM-15SBSP-TL61
廠商: ITT Corporation
英文描述: Micro-D PCB - .050 Contact Spacing
中文描述: 微D板- .050聯(lián)系間距
文件頁數(shù): 1/4頁
文件大?。?/td> 197K
代理商: MDM-15SBSP-TL61
Micro-D PCB - .050" Contact Spacing
MDM-PCB
How to Order - MDM-PCB Series
18
www.ittcannon.com
Dimensions shown in inch (mm)
Specifications and dimensions subject to change
MDM-PCB connectors are designed for use
with flex circuitry, flat cable and printed circuit
boards or multi-layer boards. They use the
standard MDM metal shell and provide high
density and high reliability in board-to-board,
board-to-cable and cable-to-cable applications.
MDM-PCB connectors are available in 8 shell
sizes with 9 to 100 contacts. Terminations
may be straight (BS) or at 90 right angle (BR,
CBR) board thickness. Jackpost mounting for
use with locking hardware is also available.
SERIES
INSULATOR MATERIAL
CONTACT ARRANGEMENT
CONTACT TYPE
TERMINATION TYPE
MOUNTING HARDWARE (Shell Flange)
MOUNTING HARDWARE FOR PCB
TERMINATION TAIL LENGTH MODIFICATION CODE
SHELL FINISH MODIFICATION CODES
SERIES
MDM - Micro "D" Metal Shell
MOUNTING HARDWARE FOR PCB
T - Threaded Insert
#2-56 Thd for Shell Sizes 9 thru 51
#4-40 Thd for Shell Size 100
No letter - none
TERMINATION TAIL LENGTH MODIFICATION CODE
None - .109 (2.77) ±.015 (0.38) Standard
L61 - .125 (3.18)
L56 - .150 (3.81)
L57 - .190 (4.83)
L39 - .250 (6.35)
L58 - .375 (9.52)
SHELL FINISH MODIFICATION CODES
None - Yellow Chromate/Cadmium over Nickel
A174 - Electroless Nickel
A172 - Gold over Nickel
A141 - Irridite/Alodine
A30 - Black Anodize
INSULATOR MATERIAL
Liquid Crystal Polymer (LCP)
CONTACT ARRANGEMENT
9, 15, 21, 25, 31, 37, 51, and 100
CONTACT TYPE
P - Pin (Plug)
S - Socket (Receptacle)
TERMINATION TYPE
BS - Straight PCB Termination
BR - Right Angle PCB Termination
CBR - Right Angle Narrow Profile PCB Terminations
MOUNTING HARDWARE (Shell Flange)
P
- Jackposts
M7 - Jackposts
M83513/5-07 (Sizes 9-51)
M17 - Jackposts
M83513/5-17 (Size 100)
No letter - none
(For special modification codes, consult
customer service.)
NOTE: Back molding material –
Epoxy Hysol #MG40FS
MDM * -
-
25
P
P
BS
T
L39
A174
RoHS COMPLIANCE
R
相關(guān)PDF資料
PDF描述
MDM-15SBSP-TL61A174 Micro-D PCB - .050 Contact Spacing
MDM-15SCBRM17 Micro-D PCB - .050 Contact Spacing
MDM-15SCBRM17- Micro-D PCB - .050 Contact Spacing
MDM-15SCBRM17-A174 Micro-D PCB - .050 Contact Spacing
MDM-15SCBRM17-L58A141 Micro-D PCB - .050 Contact Spacing
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MDM-15SBSP-TL61A174 制造商:ITT 制造商全稱:ITT Industries 功能描述:Micro-D PCB - .050 Contact Spacing
MDM-15SBS-T 制造商:ITT Interconnect Solutions 功能描述:MDM-15SBS-T - Bulk
MDM-15SCBR 制造商:ITT Interconnect Solutions 功能描述:Conn Micro D-Subminiature SKT 15 POS Solder RA Thru-Hole 15 Terminal 1 Port 制造商:ITT Interconnect Solutions 功能描述:MDM-15SCBR - Bulk 制造商:CANNON 功能描述:MICRO-D CONNECTOR, RECEPTACLE 15POS, RA-THD; Connector Type:Micro D; Series:MDM-PCB; Gender:Receptacle; No. of Contacts:15; Contact Termination:Through Hole Right Angle; Connector Mounting:PCB; Contact Plating:Gold ;RoHS Compliant: No
MDM-15SCBR-1 制造商:ITT Interconnect Solutions 功能描述:MDM-15SCBR-1 - Bulk
MDM-15SCBR-A172 制造商:ITT Interconnect Solutions 功能描述:MDM-15SCBR-A172 - Bulk
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