
MEC1–120–02–L–D–RA1–SL
MEC1–130–02–S–D–EM2
MEC1–120–02–F–D–EM2
WWW.SAMTEC.COM
(No. of Positions + 2) x
(1,00) .03937 + (2,54) .100
(No. of Positions + 2)
x (1,00) .03937
(0,36) .014
(1,00)
.03937
(8,89)
.350
(0,64)
.025
(3,12)
.123
(1,27)
.050
(11,68)
.460
(11,94)
.470
(1,78)
.070
DIA
(1,24)
.049
01
02
(8,13)
.320
(2,51)
.099
(6,81)
.268
MEC1
POSITIONS
PER ROW
PLATING
OPTION
D
1mm MICRO CARD SOCKET
MEC1-RA,
MEC1-EM SERIES
1
For complete specications and
recommended PCB layouts see
www.samtec.com?MEC1-RA
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50"
(1,27m) Ni
Current Rating: 1.5A @ 80°C
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant: Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
(0,10mm) .004" max (05-40)
(0,15mm) .006" max (50-70)
05, 08, 20, 30,
40, 50, 60, 70
–S
= 30" (0,76m) Gold on
contact, Matte Tin on tail
–L
= 10" (0,25m) Gold on
contact, Matte Tin on tail
–F
= Gold ash on contact,
Matte Tin on tail
CARD
SLOT
–02
= (1,60mm)
.062"
thick card
F-209-1
Note: Some sizes, styles and
options are non-standard,
non-returnable.
SL
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
POLARIZED
POSITIONS
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
Mates with:
(1,60mm) .062" card
APPLICATION
SPECIFIC OPTION
Elevated body height
Non-polarized
Call Samtec.
RA1
(No. of Positions + 2) x
(1,00) .03937 + (12,45) .490
02
(1,19)
.047
(0,38)
.015
(No. of Positions + 2)
x (1,00) .03937
(0,36)
.014
(8,89)
.350
(4,70)
.185
(1,00)
.03937
(4,57)
.180
(3,15)
.124
(6,81)
.268
±
01
(8,13)
.320
(5,21)
.205
MEC1
POSITIONS
PER ROW
PLATING
OPTION
D
1
05, 08, 20, 30,
40, 50, 60, 70
02
EM2
For complete specications and
recommended PCB layouts see
www.samtec.com?MEC1-EM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over 50"
(1,27m) Ni
Current Rating:
Testing Now!
Operating Temp Range:
-55°C to +125°C
Insertion Depth:
(5,84mm) .230" to
(8,13mm) .320"
RoHS Compliant:
Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead–Free Solderable: Yes
Mates with:
(1,60mm) .062" card
APPLICATION
SPECIFIC
OPTION
Edge mount leads for
(0,80mm) .031"
thick board
Non-polarized
Call Samtec.
–S
= 30" (0,76m) Gold on contact,
Matte Tin on tail
–L
= 10" (0,25m) Gold on contact,
Matte Tin on tail
–F
= Gold ash on contact,
Matte Tin on tail
POSITIONS
PER ROW
05
08
20
30
40
50
60
70
POLARIZED
POSITIONS
3, 4
5, 6
15, 16
21, 22
31, 32
41, 42
31, 32, 63 & 64
53, 54, 115 & 116
Note: Some sizes, styles and
options are non-standard,
non-returnable.
APPLICATION
Samtec recommends that pads
on the mating board be Gold plated.
1mm MEC1-RA
Rated @ -3dB
Insertion Loss
6,81mm Stack Height
Single-Ended Signaling
4.5 GHz / 9 Gbps
Differential Pair Signaling 5.5 GHz / 11 Gbps
SPECIFICATIONS