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參數資料
| 型號： | MF0ICU1001W |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 外設及接口 |
| 英文描述： | 120 micro m Bumped sawn wafer on UV-tape contactless single-trip ticket ICs |
| 封裝： | MF0ICU1001W/S7DL<Uncased die|<<<1<Always Pb-free,;MF0ICU1001W/U7DL<Uncased die|<<<1<Always Pb-free,; |
| 文件頁數： | 1/5頁 |
| 文件大小： | 56K |
| 代理商： | MF0ICU1001W |
1.
General description
1.1 Addendum
This document gives specifications for the product MF0 MOA4 U10.
The MF0 MOA4 U10 is the integrated circuit MF0 IC U10 in the package SOT500BA2.
Therefore this document encompasses all information not covered by the specification of
the package and/or the functional specification of the integrated circuit.
Detailed information on the package is given in the MOA4 contactless chip card module
specification.
Functionality of the integrated circuit is described in the MF0 IC U10 functional
specification.
2.
Features
3.
Applications
4.
Ordering information
Table 1.
Type number
5.
Functional description
5.1 Chip
Functionality of the integrated circuit is described in the document MF0 IC U10 functional
specification.
MF0 MOA4 U10
Mifare ultralight contactless chip card module
Rev. 3.1 — 7 February 2007
120931
Product data sheet
PUBLIC
Ordering information
Package
Name
Description
Ordering Code
12 NC: 9352 817 85118
MF0 MOA4 U10 / D
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MF0ICU1001W/S7DL,0 | 功能描述:RFID應答器 MIFARE ULTRALIGHT CONTACTLESS SNGL IC RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF0ICU1001W/S7DL,005 | 制造商:NXP Semiconductors 功能描述: |
| MF0ICU1001W/U7D,00 | 功能描述:RFID應答器 120 UM BUMPED SAWN WAFER RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF0ICU1001W/U7DL,0 | 功能描述:RFID應答器 MIFARE ULTRALIGHT CONTACTLESS SNGL IC RoHS:否 制造商:Murata 存儲容量:512 bit 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體: 封裝:Reel |
| MF0ICU1001W/U7DL,005 | 制造商:NXP Semiconductors 功能描述: |
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