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參數資料
| 型號： | MLL4712C-1 |
| 廠商： | MICROSEMI CORP-SCOTTSDALE |
| 元件分類： | 齊納二極管 |
| 英文描述： | 28 V, 0.5 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-213AA |
| 封裝： | HERMETIC SEALED, GLASS, MELF-2 |
| 文件頁數： | 1/3頁 |
| 文件大小： | 340K |
| 代理商： | MLL4712C-1 |
SCOTTSD A L E DIVISION
IN4678UR-1 thru 1N4717UR-1
(or MLL4678-1 thru MLL4717UR-1)
W
.Mi
cr
os
em
i
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M
1N4
099
UR-1
–1N413
5UR-1
1N4
614
UR-1
–
1N4
627
UR-1
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 0.5 WATT ZENERS
DESCRIPTION
APPEARANCE
The 1N4678UR-1 thru 1N4717UR-1 series of 0.5 watt glass surface mount
DO-213AA Zener voltage regulators provides a selection from 1.8 to 43 volts
in standard 5% tolerances as well as tighter tolerances with a very low test
current of 50 A.
These have an internal-metallurgical-bond option as
identified with the “-1” suffix. This type of internally bonded Zener package
construction is also available with equivalent military screening as described
in the Features section.
Microsemi also offers numerous other Zener
products to meet higher and lower power applications.
DO-213AA
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
Surface mount equivalent to JEDEC registered 1N4678
thru 1N4717 series
Internal metallurgical bond with the “-1” suffix
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, MSP respectively to
part numbers; (e.g. MX1N4678UR-1, MV1N4701UR-1,
MSP1N4709DUR-1, etc.)
Nonbonded types also available without the “-1” suffix
for both the axial and surface mount packages
DO-7 or DO-35 glass body axial-leaded Zener
equivalents also available per JEDEC registration with
part numbers 1N4678 thru 1N4717 on separate data
sheets
Regulates voltage over a broad operating current and
temperature range
Extensive selection from 1.8 to 43 V
Standard voltage tolerances are plus/minus 5% with
no suffix
Tight tolerances available in plus or minus 2% or 1%
with additional C or D suffix respectively
Hermetically sealed surface mount package
Nonsensitive to ESD per MIL-STD-750 Method 1020
Minimal capacitance (see Figure 3)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
Operating and Storage temperature: -65C to +175C
Thermal Resistance: 100 C/W junction to end cap, or
250
C/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page Figure 1)
Steady-State Power: 0.5 watts at end cap temperature
TEC < 125
oC or at ambient TA < 50C when mounted on
FR4 PC board as described for thermal resistance
above (see Figure 2 for derating)
Forward voltage @100 mA: 1.5 volts
Solder Temperatures: 260 C for 10 s (max)
CASE: Hermetically sealed glass DO-213AA (SOD80
or MLL34) MELF style package
TERMINALS: End caps tin-lead plated solderable per
MIL-STD-750, method 2026
POLARITY: Cathode indicated by band where diode
is to be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: cathode band only
TAPE & REEL option: Standard per EIA-481-1-B with
12 mm tape, 2000 per 7 inch reel or 5000 per 13 inch
reel (add “TR” suffix to part number)
WEIGHT: 0.04 grams
See package dimensions on last page
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright
2002
3-12-04 REV A
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