
Microsemi
Scottsdale Division
Page 1
Copyright
2005
3-22-2005 REV F
WWW
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.CO
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HSMBJ5913 thru HSMBJ5956
SILICON 3.0 Watt ZENER DIODE
S C O T TS DALE DIVISION
DESCRIPTION
PACKAGE
The HSMBJ5913-5956B series of surface mount 3.0 watt Zeners provides
voltage regulation in a selection from 3.3 to 200 volts with different tolerances
as identified by suffix letter on the part number. It is equivalent to the JEDEC
registered 1N5913 thru 1N5956B with identical electrical characteristics
except it is rated at 3.0 W instead of 1.5 W with the lower thermal resistance
features of this surface mount packaging. These plastic encapsulated Zeners
have a moisture classification of Level 1 with no dry pack required and are
also available in military equivalent screening levels by adding a prefix
identifier as further described in the Features section. Microsemi also offers
numerous other Zener products to meet higher and lower power applications.
HSMBJ5913-595
6B
DO-214AA
(see package notes)
FEATURES
APPLICATIONS / BENEFITS
Surface mount equivalent to 1N5913 to
1N5956B
Regulates voltage over a broad operating current
and temperature range
Ideal for high-density and low-profile mounting
Wide selection from 3.3 to 200 V
Zener voltage available 3.3V to 200V
Flexible axial-lead mounting terminals
Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
Nonsensitive to ESD per MIL-STD-750 Method
1020
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
High specified maximum current (I
ZM) when
adequately heat sinking
Options for screening in accordance with MIL-
PRF-19500 for JAN, JANTX, JANTXV, and
JANS are available by adding MQ, MX, MV, or
MSP prefixes respectively to part numbers.
Moisture classification is Level 1 with no dry pack
required per IPC/JEDEC J-STD-020B
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
Power dissipation at 25
C: 3.0 watts (also see
derating in Figure 1).
CASE: Void-free transfer molded thermosetting
epoxy body meeting UL94V-0
Operating and Storage temperature: -65
TERMINALS: C-bend (modified J-bend) leads, tin-
lead plated solderable per MIL-STD-750, method
2026
C to
+150
C
Thermal Resistance: 15
C/W junction to lead,
or 80
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
C/W junction to ambient when mounted on
FR4 PC board (1oz Cu) with recommended
footprint (see last page)
Steady-State Power: 3 watts at TL < 105
o
MARKING: Includes part number without prefix
(e.g. 5913B, 5926C, 5951D, etc.)
C, or
1.56 watts at TA = 25
C when mounted on FR4
PC board with recommended footprint (also see
Figure1)
TAPE & REEL option: Standard per EIA-481-1-A
with 12 mm tape 750 per 7 inch reel or 2500 per 13
inch reel (add “TR” suffix to part number)
Forward voltage @200 mA: 1.2 volts
(maximum)
WEIGHT: 0.1 grams
Solder Temperatures: 260
C for 10 s
(maximum)
See package dimensions on last page
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503