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參數資料
| 型號： | MR18R1628AF1-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| 中文描述： | （16Mx16顯示）× 2（4/8/16）件RIMM的模塊，基于256Mb阿芯片，32秒銀行，16K/32ms參考，為2.5V |
| 文件頁數： | 15/16頁 |
| 文件大小： | 419K |
| 代理商： | MR18R1628AF1-CT9 |
Page 14
Version 1.4 July 2002
MR16R1622(4/8/G)AF0
MR18R1622(4/8/G)AF0(1)
Standard RIMM Module Marking
The RIMM modules available from Samsung are marked
like Figure 7 below. This marking also assists users to
specify and verify if the correct RIMM modules are installed
in their systems. In the diagram, a label is shown attached to
the RIMM module
’
s heat spreader. Information contained on
the label is specific to the RIMM module and provides
RDRAM device information without requiring removal of
the RIMM module’s heat spreader.
Label Field
Description
Marked Text
Unit
A
Vendor Logo
RIMM Module Vendor SAMSUNG Logo Area
SAMSUNG
-
B
Country
Country of origin
KOREA
-
C
Year & Week
code
Manufactured Year & Week code
yyww
-
D
Module Memory
Capacity
Number of 8-bit or 9-bit MBytes of RDRAM storage in
RIMM module
64MB, 128MB, 256MB, 512MB
-
E
Number of
RDRAM devices
Number of RDRAM devices contained in the RIMM
module
2/4/8/16
RDRAM
devices
F
ECC Support
Indicates whether the RIMM module supports 8 (non
ECC) or 9 (ECC) bit Bytes
blank = 8 bit Bytes
ECC = 9 bit Bytes
-
G
Notice!
Hot surface caution notice.
-
-
H
Caution Logo
ISO Standard
-
-
I
Gerber & SPD
Version
PCB Gerber file & SPD code version used on RIMM
Module
Gerber : 10 = 1.0 ver.
01 = 0.1 ver.
SPD : 1 = 1.1 ver.
2 = 1.3 ver.
-
J
tRAC
Row Access Time
-32P, -32, -40, -45
ns
K
Memory Speed
Data transfer speed for RDRAM devices
1066, 800
MHz
L
Part No.
SAMSUNG RIMM Module part No.
See Table 1
-
MR18R162GAF0-CT9
1066-32P
102
KOREA 0230 512MB /16 ECC
A
B
C
D
E
F
G
L
J
H
K
I
Figure 7: RIMM Module Marking Example
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| MR18R162GAF0-CK8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
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