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參數資料
| 型號： | MR18R1628EG0-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Key Timing Parameters |
| 中文描述： | 關鍵的定時參數 |
| 文件頁數： | 1/16頁 |
| 文件大小： | 442K |
| 代理商： | MR18R1628EG0-CT9 |
Page 0
MR16R1624(8/G)EG0
MR18R1624(8/G)EG0
Version 1.0 May 2004
Change History
Version 0.1 (December 2003) -
Preliminary
* First copy.
* Based on the 1.0 ver. (July 2002) 256/288Mbit D-die RIMM
Module Datasheet
Version 1.0 (May 2004)
* Eliminate "Preliminary"
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相關代理商/技術參數 |
參數描述 |
|---|---|
| MR18R162GAF0-CK8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R162GAF0-CM8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R162GAF0-CN9 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R162GAF0-CT9 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:(16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V |
| MR18R162GEG0-CK8 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Key Timing Parameters |
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