
1
2
3
4
Drain-Source Leakage Current
Gate-Source Threshold Voltage
Drain-Source On Resistance
Drain-Source On Resistance
Forward Transconductance
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Drain-Source Breakdown Voltage
Gate-Source Leakage Current
N-Channel (Q1,Q3,Q5)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
P-CHANNEL (Q2,Q4,Q6)
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
BODY DIODE
91mJ
210mJ
+175°C MAX
-55°C to +150°C
-55°C to +125°C
300°C MAX
Single Pulse Avalanche Energy
(Q1,Q3,Q5)
(Q2,Q4,Q6)
Junction Temperature
Storage Temperature
Case Operating Temperature Range
Lead Temperature Range
(10 Seconds)
Drain to Source Voltage
Drain to Gate Voltage
(R
GS
=1M
)
Gate to Source Voltage
(Continuous)
Continuous Current
Pulsed Current
Thermal Resistance
(Junction to Case)
ABSOLUTE MAXIMUM RATINGS
V
DSS
V
DGDR
V
GS
I
D
I
DM
R
TH-JC
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T
J
T
ST
T
C
T
LD
100V MAX
100V MAX
±20V MAX
5.6A MAX
22A MAX
6°C/W
○
○
○
○
○
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○
○
V
GS
=0 I
D
=0.25mA (All Transistors)
V
DS
=100V V
GS
=0V (Q1,Q3,Q5)
V
DS
=-100V V
GS
=0V (Q2,Q4,Q6)
V
GS
=±20V V
DS
=0 (All Transistors)
V
DS
=V
GS
I
D
=250μA (Q1,Q3,Q5)
V
DS
=V
GS
I
D
=250μA (Q2,Q4,Q6)
V
GS
=10V I
D
=5.6A (Q1,Q3,Q5)
V
GS
=-10V I
D
=-3.4A (Q2,Q4,Q6)
V
GS
=10V I
D
=5.6A (Q1,Q3,Q5)
V
GS
=10V I
D
=-3.4A (Q2,Q4,Q6)
V
DS
=25V I
D
=5.7A (Q1,Q3,Q5)
V
DS
=-50V I
D
=-3.4A (Q2,Q4,Q6)
I
D
=5.7A
V
DS
=80V
V
GS
=10V
V
DD
=50V
I
D
=5.7A
R
G
=22
R
D
=8.6
V
GS
=0V
V
DS
=25V
f=1MHz
I
D
=-6.8A
V
DS
=-80V
V
GS
=-10V
V
DD
=-50V
I
D
=-6.8A
R
G
=18
R
D
=7.1
V
GS
=0V
V
DS
=-25V
f=1MHz
I
S
=5.5A V
GS
=0V (Q1,Q3,Q5)
I
S
=-5.6A V
GS
=0V (Q2,Q4,Q6)
I
S
=5.7A di/dt=100A/μS (Q1,Q3,Q5)
I
S
=-6.8A di/dt=100A/μS (Q2,Q4,Q6)
I
S
=5.7A di/dt=100A/μS (Q1,Q3,Q5)
I
S
=-6.8A di/dt=100A/μS (Q2,Q4,Q6)
Parameter
Units
MSK3001
Test Conditions
V
μA
μA
nA
V
V
S
S
nC
nC
nC
nS
nS
nS
nS
pF
pF
pF
nC
nC
nC
nS
nS
nS
nS
pF
pF
pF
V
V
nS
nS
μC
μC
Min.
100
-
-
-
2.0
-2.0
-
-
-
-
2.7
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Typ.
-
-
-
-
-
-
0.18
0.37
-
-
-
-
-
-
-
4.5
23
32
23
330
92
54
-
-
-
9.6
29
21
25
390
170
45
1.3
-1.6
99
100
0.39
0.33
Max.
-
25
-100
±100
4.0
-4.0
0.30
0.75
0.21
0.60
-
-
25
4.8
11
-
-
-
-
-
-
-
18
3.0
9.0
-
-
-
-
-
-
-
-
-
150
200
0.58
0.66
ELECTRICAL SPECIFICATIONS
2
1
3
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
NOTES:
This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.
Resistance as seen at package pins.
Resistance for die only; use for thermal calculations.
T
A
=25°C unless otherwise specified.
4
2
Rev. B 7/00