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參數資料
| 型號： | 0805L020YR |
| 廠商： | Littelfuse, Inc. |
| 英文描述： | POLYFUSE Resettable PTCs Surface Mount |
| 中文描述： | POLYFUSE復式膽道鏡表面貼裝 |
| 文件頁數： | 3/4頁 |
| 文件大?。?/td> | 319K |
| 代理商： | 0805L020YR |
POLYFUSE Resettable PTCs
Surface Mount
www.littelfuse.com
2006 Littelfuse
0805L Series
Specifications are subject to change without notice.
Electronics Designers Guide
Environmental Specifications
Operating/Storage
Temperature
-40°Cto+85°C
Maximum Device Surface
Temperature in Tripped State
125°C
Passive Aging
+85°C,1000hours
±5%typicalresistancechange
Humidity Aging
+85°C,85%R.H.1000hours
±5%typicalresistancechange
Thermal Shock
MIL-STD-202Method107G
+85°C/-40°C20times
-30%typicalresistancechange
Solvent Resistance
MIL-STD-202,Method215
Nochange
Vibration
MIL-STD-883C,Method2007.1,
ConditionA
Nochange
Physical Specifications
Terminal Material
Gold-PlatedCopperorSolder-Plated
Copper(SolderMaterial:MatteTin(Sn))
Lead Solderability
MeetsEIASpecificationRS186-9E,ANSI/
J-STD-002Category3.
Soldering Parameters
Condition
Reflow
Peak Temp/ Duration Time
260°C/10Sec
Time above liquids (TAL) 220°C
60Sec~100Sec
Preheat 120°C~ 180°C
50Sec~150Sec
Storage Condition
0°C~35°C,<
=70%RH
Recommendedreflowmethods:IR,vaporphaseoven,hotair
oven,N
2environmentforlead-free
Devicesarenotdesignedtobewavesolderedtothebottomside
oftheboard.
Recommendedmaximumpastethicknessis0.25mm(0.010inch)
Devicescanbecleanedusingstandardindustrymethodsand
solvents.
Note:Ifreflowtemperaturesexceedtherecommendedprofile,
devicesmaynotmeettheperformancerequirements.
Preheating
120
180
220
260
0
60 to 100
Temperature
(°
C)
Soldering
Cooling
120
50 to 150
Time(s)
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