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參數資料
| 型號： | NCP1421D |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | DC/DC變換器 |
| 英文描述： | 600 mA Sync-Rect PFM Step-Up DC-DC Converter Step-Up DC-DC Converter with True-Cutoff and Ring-Killer |
| 中文描述： | 600毫安同步整流PFM升壓型DC - DC轉換器升壓型DC - DC轉換器與True - Cutoff和Ring殺手 |
| 文件頁數： | 10/14頁 |
| 文件大小： | 116K |
| 代理商： | NCP1421D |
NCP1421
http://onsemi.com
10
reference voltage of the controller is disabled and the
controller typically consumes only 50 nA of current. If the
pin 2 voltage is raised to higher than 0.5 V (for example, by
a resistor connected to V
IN)
, the IC is enabled again, and the
internal circuit typically consumes 8.5 A of current from
the OUT pin during normal operation.
LowBattery Detection
A comparator with 30 mV hysteresis is applied to
perform the lowbattery detection function. When pin 2
(LBI/EN) is at a voltage (defined by a resistor divider from
the battery voltage) lower than the internal reference
voltage of 1.20 V, the comparator output turns on a 50
low side switch. It pulls down the voltage at pin 3 (LBO)
which has hundreds of k of pullhigh resistance. If the
pin 2 voltage is higher than 1.20 V + 30 mV, the comparator
output turns off the 50
low side switch. When this occurs,
pin 3 becomes high impedance and its voltage is pulled
high again.
APPLICATIONS INFORMATION
Output Voltage Setting
A typical application circuit is shown in Figure 26. The
output voltage of the converter is determined by the
external feedback network comprised of R1 and R2. The
relationship is given by:
VOUT
1.20 V
1
R1
R2
where R1
and R2 are the upper and lower feedback
resistors, respectively.
Low Battery Detect Level Setting
The Low Battery Detect Voltage of the converter is
determined by the external divider network that is
comprised of R3 and R4. The relationship is given by:
VLB
1.20 V
1
R3
R4
where R3
and R4 are the upper and lower divider resistors
respectively.
Inductor Selection
The NCP1421 is tested to produce optimum performance
with a 5.6 H inductor at V
IN
= 2.5 V and V
OUT
= 3.3 V,
supplying an output current up to 600 mA. For other
input/output requirements, inductance in the range 3 H to
10
H can be used according to end application
specifications. Selecting an inductor is a compromise
between output current capability, inductor saturation
limit, and tolerable output voltage ripple. Low inductance
values can supply higher output current but also increase
the ripple at output and reduce efficiency. On the other
hand, high inductance values can improve output ripple
and efficiency; however, it is also limited to the output
current capability at the same time.
Another parameter of the inductor is its DC resistance.
This resistance can introduce unwanted power loss and
reduce overall efficiency. The basic rule is to select an
inductor with the lowest DC resistance within the board
space limitation of the end application. In order to help with
the inductor selection, reference charts are shown in
Figure 27 and 28.
Capacitors Selection
In all switching mode boost converter applications, both
the
input
and
output
terminals
see
impulsive
voltage/current waveforms. The currents flowing into and
out of the capacitors multiply with the Equivalent Series
Resistance (ESR) of the capacitor to produce ripple voltage
at the terminals. During the SynRect switchoff cycle, the
charges stored in the output capacitor are used to sustain the
output load current. Load current at this period and the ESR
combine and reflect as ripple at the output terminals. For
all cases, the lower the capacitor ESR, the lower the ripple
voltage at output. As a general guideline, low ESR
capacitors should be used. Ceramic capacitors have the
lowest ESR, but low ESR tantalum capacitors can also be
used as an alternative.
PCB Layout Recommendations
Good PCB layout plays an important role in switching
mode power conversion. Careful PCB layout can help to
minimize ground bounce, EMI noise, and unwanted
feedback that can affect the performance of the converter.
Hints suggested below can be used as a guideline in most
situations.
Grounding
A starground connection should be used to connect the
output power return ground, the input power return ground,
and the device power ground together at one point. All
highcurrent paths must be as short as possible and thick
enough to allow current to flow through and produce
insignificant voltage drop along the path. The feedback
signal path must be separated from the main current path
and sense directly at the anode of the output capacitor.
Components Placement
Power components (i.e., input capacitor, inductor and
output capacitor) must be placed as close together as
possible. All connecting traces must be short, direct, and
thick. High current flowing and switching paths must be
kept away from the feedback (FB, pin 1) terminal to avoid
unwanted injection of noise into the feedback path.
Feedback Network
Feedback of the output voltage must be a separate trace
detached from the power path. The external feedback
network must be placed very close to the feedback (FB,
pin 1) pin and sense the output voltage directly at the anode
of the output capacitor.
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