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參數(shù)資料
| 型號(hào)： | NCP1422MNR2G |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | 800 mA Sync−Rect PFM Step−Up DC−DC Converter with True−Cutoff and Ring−Killer |
| 中文描述： | 1.5 A SWITCHING REGULATOR, 1200 kHz SWITCHING FREQ-MAX, PDSO10 |
| 封裝： | 3 X 3 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, DFN-10 |
| 文件頁(yè)數(shù)： | 13/14頁(yè) |
| 文件大小： | 142K |
| 代理商： | NCP1422MNR2G |
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NCP1422
http://onsemi.com
13
PACKAGE DIMENSIONS
DFN10, 3 x 3mm, 0.5mm Pitch
CASE 485C01
ISSUE A
10X
SEATING
PLANE
L
D
E
0.15 C
A
A1
e
D2
E2
b
1
5
10
6
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. TERMINAL b MAY HAVE MOLD COMPOUND
MATERIAL ALONG SIDE EDGE. MOLD
FLASHING MAY NOT EXCEED 30 MICRONS
ONTO BOTTOM SURFACE OF TERMINAL b.
6. DETAILS A AND B SHOW OPTIONAL VIEWS
FOR END OF TERMINAL LEAD AT EDGE OF
PACKAGE.
B
A
0.15 C
TOP VIEW
SIDE VIEW
BOTTOM VIEW
PIN 1
REFERENCE
0.10 C
0.08 C
(A3)
C
10X
10X
0.10 C
0.05 C
A B
NOTE 3
K
10X
DIM
A
A1
A3
b
D
D2
E
E2
e
K
MIN
0.80
0.00
0.20 REF
0.18
3.00 BSC
2.45
3.00 BSC
1.75
0.50 BSC
0.19 TYP
MAX
1.00
0.05
MILLIMETERS
0.30
2.55
1.85
L
L1
0.35
0.00
0.45
0.03
DETAIL A
2X
2X
L1
DETAIL A
Bottom View
(Optional)
éé
éé
A1
A3
DETAIL B
Side View
(Optional)
EDGE OF PACKAGE
MOLD CMPD
EXPOSED Cu
DETAIL B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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