欧美成人免费电影,国产欧美一区二区三区精品酒店,精品国产a毛片,色网在线免费观看

參數資料
型號: NE1617ADS,112
廠商: NXP Semiconductors
文件頁數: 24/30頁
文件大小: 305K
描述: IC TEMP MONITOR 16SSOP
標準包裝: 100
功能: 溫度監控系統(傳感器)
傳感器類型: 內部和外部
感應溫度: -55°C ~ 125°C,外部傳感器
精確度: ±3°C 本地(最大),±5°C 遠程(最大)
拓撲: ADC,多路復用器,寄存器庫
輸出類型: SMBus?
輸出警報:
輸出風扇:
電源電壓: 3 V ~ 5.5 V
工作溫度: -55°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 16-SSOP(0.154",3.90mm 寬)
供應商設備封裝: 16-SSOP
包裝: 管件
其它名稱: 935268119112
NE1617ADS
NE1617ADS-ND
NE1617A
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5  20 March 2012
24 of 30
NXP Semiconductors
NE1617A
Temperature monitor for microprocessor systems
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 Surface mount reflow 
soldering description.
13.1   Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2   Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
" Through-hole components
"  Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
"  Board specifications, including the board finish, solder masks and vias
"  Package footprints, including solder thieves and orientation
"  The moisture sensitivity level of the packages
"  Package placement
"  Inspection and repair
"  Lead-free soldering versus SnPb soldering
13.3   Wave soldering
Key characteristics in wave soldering are:
"  Process issues, such as application of adhesive and flux, clinching of leads, board 
transport, the solder wave parameters, and the time during which components are
exposed to the wave
"  Solder bath specifications, including temperature and impurities
相關PDF資料
PDF描述
NE1619DS,118 IC TEMP MONITOR 16SSOP
NIS5112D1R2G IC ELECTRONIC FUSE HOTSWAP 8SOIC
NIS5132MN2TXG IC ELECTRONIC FUSE 12V 10DFN
NIS5132MN3TXG IC ELECTRONIC FUSE 12V 10-DFN
NSI45015WT1G IC LED DRIVER LINEAR SOD-123
相關代理商/技術參數
參數描述
NE1617DS 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 3OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor
NE1617DS,112 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor
NE1617DS,118 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 3OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor
NE1618 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Temperature monitor for microprocessor systems
NE1618DS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Temperature monitor for microprocessor systems
主站蜘蛛池模板: 高清| 自贡市| 长宁县| 广西| 苏尼特右旗| 白银市| 无极县| 嘉荫县| 交城县| 泾源县| 常德市| 偏关县| 青冈县| 宜昌市| 伊春市| 武平县| 西吉县| 白城市| 顺昌县| 理塘县| 云南省| 双辽市| 嘉定区| 青田县| 邵阳市| 德州市| 乐昌市| 松滋市| 邹城市| 鹤壁市| 吕梁市| 静宁县| 宾阳县| 莱西市| 霍林郭勒市| 岚皋县| 苍溪县| 定南县| 武定县| 桃源县| 和田市|