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參數(shù)資料
型號: NIS5132MN2TXG
廠商: ON Semiconductor
文件頁數(shù): 2/11頁
文件大小: 258K
描述: IC ELECTRONIC FUSE 12V 10DFN
標準包裝: 3,000
功能: 電子保險絲
輸入電壓: 9 V ~ 18 V
電流 - 輸出: 3.6A
工作溫度: -40°C ~ 150°C
安裝類型: 表面貼裝
封裝/外殼: 10-VFDFN 裸露焊盤
供應商設備封裝: 10-DFN(3x3)
包裝: 帶卷 (TR)
NIS5132 Series
http://onsemi.com
2
Figure 1. Block Diagram
ENABLE/
FAULT
SOURCE
I
LIMIT
dv/dt
GND
VCC
Enable
Charge
Pump
Thermal
Shutdown
UVLO
Current
Limit
Voltage
Clamp*
dv/dt
Control
(*MN1 and MN2 versions)
Table 1. FUNCTIONAL PIN DESCRIPTION
Pin
Function
Description
1
Ground
Negative input voltage to the device. This is used as the internal reference for the IC.
2
dv/dt
The internal dv/dt circuit controls the slew rate of the output voltage at turn on. It has an internal
capacitor that allows it to ramp up over a period of 2 ms. An external capacitor can be added to
this pin to increase the ramp time. If an additional time delay is not required, this pin should be left
open.
3
Enable/Fault
The enable/fault pin is a tristate, bidirectional interface. It can be used to enable or disable the
output of the device by pulling it to ground using an open drain or open collector device. If a
thermal fault occurs, the voltage on this pin will go to an intermediate state to signal a monitoring
circuit that the device is in thermal shutdown. It can also be connected to another device in this
family to cause a simultaneous shutdown during thermal events.
4
I
Limit
A resistor between this pin and the source pin sets the overload and short circuit current limit
levels.
610
Source
This pin is the source of the internal power FET and the output terminal of the fuse.
11 (belly pad)
V
CC
Positive input voltage to the device.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage, operating, steadystate (V
CC
 to GND, Note 1)
Transient (100 ms)
V
IN
0.6 to 18
0.6 to 25
V
Thermal Resistance, JunctiontoAir
0.1 in
2
 copper (Note 2)
0.5 in
2
 copper (Note 2)
q
JA
227
95
癈/W
Thermal Resistance, JunctiontoLead (Pin 1)
q
JL
27
癈/W
Thermal Resistance, JunctiontoCase
q
JC
20
癈/W
Total Power Dissipation @ T
A
 = 25癈
Derate above 25癈
P
max
1.3
10.4
W
mW/癈
Operating Temperature Range (Note 3)
T
J
40 to 150
Nonoperating Temperature Range
T
J
55 to 155
Lead Temperature, Soldering (10 Sec)
T
L
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1.  Negative voltage will not damage device provided that the power dissipation is limited to the rated allowable power for the package.
2.  1 oz. copper, doublesided FR4.
3.  Thermal limit is set above the maximum thermal rating. It is not recommended to operate this device at temperatures greater than the
maximum ratings for extended periods of time.
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