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參數資料
| 型號： | P13252EJ2V0AN00 |
| 英文描述： | uPC2708TB/2709TB/2710TB. uPC2762TB/2763TB. uPC2771TB/2776TB 6-Pin Super Mini-Mold Silicon Medium-Power High-Frequency Amplifier MMIC |
| 中文描述： | uPC2708TB/2709TB/2710TB。 uPC2762TB/2763TB。 uPC2771TB/2776TB 6引腳超小型模具硅中功率高頻單片放大器 |
| 文件頁數： | 5/39頁 |
| 文件大小： | 211K |
| 代理商： | P13252EJ2V0AN00 |
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Application Note P13252EJ2V0AN00
5
CONTENTS
1.
INTRODUCTION...............................................................................................................................
7
2.
PRODUCT LINEUP .........................................................................................................................
2.1 Characteristics.......................................................................................................................................
2.2 Test Circuit .............................................................................................................................................
7
7
9
3.
APPLICATION CHARACTERISTIC EXAMPLE ............................................................................
3.1
μ
PC2708TB,
μ
PC2709TB,
μ
PC2710TB..................................................................................................
3.2
μ
PC2762TB,
μ
PC2763TB,
μ
PC2771TB..................................................................................................
3.3
μ
PC2776TB.............................................................................................................................................
10
11
17
31
4.
CONCLUSION..................................................................................................................................
32
APPENDIX S PARAMETER REFERENCE VALUES (T
A
= +25°C)....................................................
33
Precautions for design-ins
(1) Observe precautions for handling because of electro-static sensitive devices.
(2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All
the ground pins must be connected together with wide ground pattern to decrease impedance difference.
(3) The bypass capacitor should be attached to the V
CC
pin.
(4) The inductor must be attached between V
CC
pin and output pin. The inductance value should be determined in
accordance with desired frequency.
(5) The DC cut capacitor must be each attached to the input and output pins.
(6) Apply voltage only to V
CC
pin and output pin. Do not apply voltage to input pin nor regulate input pin voltage (e.g.
direct DC pull-down).
(7) External components cannot modify the IC’s internal circuit feedback.
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