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參數資料
型號: PC745BVZFU300LD
英文描述: MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
中文描述: 微處理器| 32位|的CMOS | BGA封裝| 255PIN |塑料
文件頁數: 1/48頁
文件大小: 276K
代理商: PC745BVZFU300LD
1/48
PC755B/745B
September 2000
PowerPC755B/745B
RISC MICROPRO-
CESSOR
Features
18.1SPECint95, estimates 12.3 SPECfp95 @400Mhz (PC755B)
15.7SPECint95, 9SPECfp95 @350Mhz (PC745B)
733 MIPS @ 400Mhz (PC755B) et 641 MIPS@350Mhz (PC745B)
Selectable bus clock (12 CPU bus dividers up to 10x)
P
D
typical 6,4W @ 400Mhz, full operating conditions.
Nap, doze and sleep modes for power savings
Superscalar (3 instructions per clock cycle) (two instruction + branch)
4 PetaByte virtual memory, 4 Gigabytes of physical memory.
64-bit data and 32-bit address bus interface.
32KB instruction and data cache.
Six independent execution units.
Write-back and write-through operations.
f
int
max = 400Mhz (TBC)
f
bus
max = 100Mhz
Voltage I/O 1,8V/3,3V ; voltage int 2.0 V
Description
PC755B and PC745B PowerPC microprocessors are high-performance, low-power, 32-bit
implementations of the PowerPC Reduced Instruction Set Computer (RISC) architecture, spe-
cially enhanced for embedded applications.
PC755B and PC745B microprocessors differ only in that the PC755B features an enhanced,
dedicated L2 cache interface with on-chip L2 tags. The PC755B is a drop-in replacement fo r the
award winning PowerPC 750
TM
microprocessor and is footprint and user software code compat-
ible with the MPC7400 microprocessor withAltiVec
TM
technology. The PC745B is a drop-in
replacement for the PowerPC 740
TM
microprocessor and is also footprint and user soltware
code compatible with the PowerPC 603e
TM
microprocessor. PC755B/745B microprocessors
provide on-chip debug support and are fully JTAG-compliant.
The PC745B microprocessor is pin compatible with the TSPC603e family.
Screening
This product is manufactured in full compliance with :
CBGA upscreenings based upon ATMEL-Grenoble standards
Full military temperature range (Tj=-55
o
C,+125
o
C)
industrial temperature range (Tj=-40
o
C,+110
o
C)
PBGA255
Flip-Chip Plastic Ball Grid Array
ZF suffix
Preliminary
Specification
α
-site
PBGA360
Flip-Chip Plastic Ball Grid Array
ZF suffix
相關PDF資料
PDF描述
PC745BVZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC755BMZFU300LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BMZFU350LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
PC755BMZFU400LD MICROPROCESSOR|32-BIT|CMOS|BGA|360PIN|PLASTIC
相關代理商/技術參數
參數描述
PC745BVZFU350LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC745BVZFU400LD 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|BGA|255PIN|PLASTIC
PC74631-1 制造商: 功能描述: 制造商:undefined 功能描述:
PC74HC00D 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Quad 2-input NAND Gate
PC74HC04T 制造商:NXP Semiconductors 功能描述:
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