- 您現在的位置：買賣IC網 > PDF目錄382382 > PCF8598C-2P02 (NXP Semiconductors N.V.) 1024 ⅴ 8-bit CMOS EEPROM with I2C-bus interface PDF資料下載
參數資料
| 型號： | PCF8598C-2P02 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | DRAM |
| 英文描述： | 1024 ⅴ 8-bit CMOS EEPROM with I2C-bus interface |
| 中文描述： | 1024ⅴ8位CMOS EEPROM，帶有I2C總線接口 |
| 文件頁數： | 16/21頁 |
| 文件大小： | 395K |
| 代理商： | PCF8598C-2P02 |
Philips Semiconductors
PCF8598C-2
1024
×
8-bit CMOS EEPROM with I
2
C-bus interface
Product data
Rev. 06 — 22 October 2004
16 of 21
9397 750 14219
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
15. Soldering
15.1 Introduction
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs,
but it is not suitable for fine pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental forces the worldwide use of
lead-free solder pastes is increasing.
15.2 Through-hole mount packages
15.2.1
Soldering by dipping or by solder wave
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
15.2.2
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
°
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
°
C, contact may be up to 5 seconds.
15.3 Surface mount packages
15.3.1
Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all the BGA and SSOP-T packages
相關PDF資料 |
PDF描述 |
|---|---|
| PCF8598C-2T02 | 1024 ⅴ 8-bit CMOS EEPROM with I2C-bus interface |
| PCF86C410T | 8-BIT MICROCONTROLLER |
| PCF86C610P | 8-BIT MICROCONTROLLER |
| PCF86C610T | 8-BIT MICROCONTROLLER |
| PCF87852 | Bluetooth baseband controller |
相關代理商/技術參數 |
參數描述 |
|---|---|
| PCF8598C-2T | 制造商:ICS 制造商全稱:ICS 功能描述:PCF85xxC-2 family 256 to 1024 ⅴ 8-bit CMOS EEPROMs with I2C-bus interface |
| PCF8598C-2T/02,112 | 功能描述:電可擦除可編程只讀存儲器 8K/1024 電可擦除可編程只讀存儲器 I2C RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數據保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF8598C-2T/02,118 | 功能描述:電可擦除可編程只讀存儲器 8K/1024 電可擦除可編程只讀存儲器 I2C BUS RoHS:否 制造商:Atmel 存儲容量:2 Kbit 組織:256 B x 8 數據保留:100 yr 最大時鐘頻率:1000 KHz 最大工作電流:6 uA 工作電源電壓:1.7 V to 5.5 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-8 |
| PCF8598C-2T02 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1024 ⅴ 8-bit CMOS EEPROM with I2C-bus interface |
| PCF8598E-2P | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:I2C Serial EEPROM |
發布緊急采購，3分鐘左右您將得到回復。