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參數資料
| 型號： | PF808-AG12D28 |
| 廠商： | THOMAS BETTS CORP |
| 元件分類： | 插座 |
| 英文描述： | DIP8, IC SOCKET |
| 文件頁數： | 1/3頁 |
| 文件大小： | 57K |
| 代理商： | PF808-AG12D28 |
E
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
E4
Quality & Innovation From The
Product Group
PF510 & PF800 Series Pressfit SIP & DIP Sockets
FEATURES:
Press fit design does not require soldering
Available in two sizes to fit .028” (0,71) or .040” (1,02) finished hole
Available in 8 through 64 pin DIP or 1 to 20 pin SIP packages
Precision four-finger inner contact provides concentric funnel entry for
easy lead insertion
APPLICATION DIMENSIONS:
PCB Thickness Range: Standard .093" (2,36) minimum
IC Pin Dimension Range: .016"(0,41) thru .021" (0,53) dia.,
.105" (2,67) min. length
PCB Hole Size Range: .028"
± .002" (0,71 ± 0,05) and .040 ± .003"
(1,02
± 0,13)
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL 94V-0
Inner Contact .................. Beryllium copper, gold or tin/lead plated
Sleeve ............................ Brass, tin/lead plated
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005,
Condition II
Shock .............................. Passed MIL-STD-1344, Method 2004,
Condition C, 100 G's
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (typ.)
Inner Contact
Retention .................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic .................... 3.0 Lbs. per line minimum
Pin Retention in Board .. 5.0 Lbs. min. per MIL-STD 2166
Insertion Force .............. 179 Grams (6.3 oz.) average with a .018" (0,46)
dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD 202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. per MIL-STD-1344,
Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Operation Temperature .. Gold inner contact -55
° C to +125° C,
Tin/lead inner contact -55
° C to +105° C
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Gas Tight ........................ Passed EIA-364-36
PF510-AG95D-14
PF828-AG95D-28
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