- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄368063 > PM50CLB120_05 (Mitsubishi Electric Corporation) FLAT-BASE TYPE INSULATED PACKAGE PDF資料下載
參數(shù)資料
| 型號： | PM50CLB120_05 |
| 廠商： | Mitsubishi Electric Corporation |
| 英文描述： | FLAT-BASE TYPE INSULATED PACKAGE |
| 中文描述： | 平性基地型絕緣包裝 |
| 文件頁數(shù)： | 1/8頁 |
| 文件大?。?/td> | 142K |
| 代理商： | PM50CLB120_05 |
May 2005
MITSUBISHI <INTELLIGENT POWER MODULES>
PM50CLB120
FLAT-BASE TYPE
INSULATED PACKAGE
PM50CLB120
FEATURE
a) Adopting new 5th generation IGBT (CSTBT) chip, which
performance is improved by 1
μ
m fine rule process.
For example, typical V
ce
(sat)=1.9V @Tj=125
°
C
b) I adopt the over-temperature conservation by Tj detection of
CSTBT chip, and error output is possible from all each con-
servation upper and lower arm of IPM.
c) New small package
Reduce the package size by 32%, thickness by 22% from
S-DASH series.
3
φ
50A, 1200V Current-sense IGBT type inverter
Monolithic gate drive & protection logic
Detection, protection & status indication circuits for, short-
circuit, over-temperature & under-voltage (P-Fo available
from upper arm devices)
Acoustic noise-less 5.5kW/7.5kW class inverter application
UL Recognized
Yellow Card No.E80276(N)
File No.E80271
APPLICATION
General purpose inverter, servo drives and other motor controls
PACKAGE OUTLINES
Dimensions in mm
22
7.75
98.25
2.5
23
23
23
19.5
2
2
5
17
16
3
19-
I
0.5
9
1
2
9.5
1
1
11.5
2
φ
2
106
±
0.25
66.5
19.75
3.25
7
4
4
3
4
4
4
4
4
4
4
4
4
4
16
15.25
6-2
3-2
3-2
3-2
16
16
120
1. VUPC
2. UFO
3. UP
4. VUP1
5. VVPC
6. VFO
7. VP
8. VVP1
9. VWPC
10. WFO
11. WP
12. VWP1
13. VNC
14. VN1
15. NC
16. UN
17. VN
18. WN
19. Fo
Terminal code
N
P
1
5
B
U
V
W
9
13
19
4
φ
25
MOUNTING HOLES
2-
φ
5.5
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| PM50CTJ060-3 | INSULATED PACKAGE FLAT-BASE TYPE |
| PM50CTK060 | FLAT-BASE TYPE INSULATED PACKAGE |
| PM50RHA060 | TRANSISTOR | IGBT POWER MODULE | 3-PH BRIDGE | 600V V(BR)CES | 50A I(C) |
| PM50RHB060 | TRANSISTOR | IGBT POWER MODULE | 3-PH BRIDGE | 600V V(BR)CES | 50A I(C) |
| PM50RHA120 | FLAT BASE TYPE INSULATED PACKAGE |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PM50CS1D060 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM50CS1D120 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:INTELLIGENT POWER MODULES FLAT-BASE TYPE INSULATED PACKAGE |
| PM50CSD060 | 功能描述:MOD IPM 6PAC 600V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊 |
| PM50CSD120 | 功能描述:MOD IPM 6PAC 1200V 50A RoHS:是 類別:半導(dǎo)體模塊 >> 功率驅(qū)動器 系列:Intellimod™ 標(biāo)準(zhǔn)包裝:15 系列:SPM® 類型:FET 配置:三相反相器 電流:1.8A 電壓:500V 電壓 - 隔離:1500Vrms 封裝/外殼:23-DIP 模塊 |
| PM50CSE060 | 制造商:MITSUBISHI 制造商全稱:Mitsubishi Electric Semiconductor 功能描述:FLAT-BASE FLAT-BASE TYPE INSULATED PACKAGE |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。