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參數資料
| 型號： | Q62703-Q2768 |
| 廠商： | SIEMENS AG |
| 英文描述： | Multi TOPLED |
| 中文描述： | 多TOPLED |
| 文件頁數： | 6/8頁 |
| 文件大小： | 552K |
| 代理商： | Q62703-Q2768 |
Semiconductor Group
6
LSG K370, LSP K370, LOP K370, LOG K370
Durchlastrom
I
F
=
f
(
V
F
)
Forward current
T
A
= 25 C
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible pulse handling capability
Duty cycle D = parameter,
T
A
= 25 C
LS, LO, LG
Relativer Lichtstrom
Φ
V
/
Φ
V(15 mA)
=
f
(
I
F
)
Relative luminous flux
T
A
= 25 C
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible pulse handling capability
Duty cycle D = parameter,
T
A
= 25 C
LP
相關PDF資料 |
PDF描述 |
|---|---|
| Q62703-Q2884 | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 0.1uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 0603; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.063" x 0.032"; Container: Bulk; Features: Flexible Termination; Unmarked |
| Q62703-Q2885 | Super Multi TOPLED High-Current LED |
| Q62703-Q2893 | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 0.1uF; Working Voltage (Vdc)[max]: 16V; Capacitance Tolerance: +/-20%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 0603; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.063" x 0.032"; Container: Bulk; Features: Flexible Termination; Unmarked |
| Q62703-Q2894 | Multi TOPLEDRG |
| Q62703-Q2895 | Multi TOPLEDRG |
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