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參數資料
型號: Q62703-Q3367
廠商: SIEMENS AG
英文描述: Mini SIDELED
中文描述: 迷你SIDELED
文件頁數: 3/8頁
文件大小: 552K
代理商: Q62703-Q3367
Semiconductor Group
3
Grenzwerte
2)
Maximum Ratings
2)
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS, LO, LG
LP
Betriebstemperatur
Operating temperature range
T
op
– 55 ... + 100
– 55 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
– 55 ... + 100
– 55 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
+ 100
C
Durchlastrom
Forward current
I
F
40
30
mA
Stostrom
Surge current
t
10
μ
s, D = 0.005
Verlustleistung
Power dissipation
T
A
25
°
C
Wrmewiderstand
Thermal resistance
Sperrschicht / Luft
Junction / air
I
FM
0.5
0.5
A
P
tot
140
100
mW
R
th JA
400
400
K/W
2)
Die angegebenen Grenzdaten gelten für den Chip, für den sie angegeben sind, unabhngig vom
Betriebszustand des anderen.
2)
The stated maximum ratings refer to the specified chip regardless of the other one’s operating status.
LSG K370, LSP K370, LOP K370, LOG K370
相關PDF資料
PDF描述
Q62703-Q3368 Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 470pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Flexible Termination; Unmarked
Q62703-Q3369 Mini SIDELED
Q62703-Q3370 Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 470pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: Flexible Termination; Unmarked
Q62703-Q3371 Multi TOPLED Cathodes On One Side
Q62703-Q3372 Multi TOPLED Cathodes On One Side
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