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參數資料
型號: Q62703-Q3398
廠商: SIEMENS AG
英文描述: Mini TOPLED
中文描述: 迷你TOPLED
文件頁數: 3/8頁
文件大小: 552K
代理商: Q62703-Q3398
Semiconductor Group
3
Grenzwerte
2)
Maximum Ratings
2)
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS, LO, LG
LP
Betriebstemperatur
Operating temperature range
T
op
– 55 ... + 100
– 55 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
– 55 ... + 100
– 55 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
+ 100
C
Durchlastrom
Forward current
I
F
40
30
mA
Stostrom
Surge current
t
10
μ
s, D = 0.005
Verlustleistung
Power dissipation
T
A
25
°
C
Wrmewiderstand
Thermal resistance
Sperrschicht / Luft
Junction / air
I
FM
0.5
0.5
A
P
tot
140
100
mW
R
th JA
400
400
K/W
2)
Die angegebenen Grenzdaten gelten für den Chip, für den sie angegeben sind, unabhngig vom
Betriebszustand des anderen.
2)
The stated maximum ratings refer to the specified chip regardless of the other one’s operating status.
LSG K370, LSP K370, LOP K370, LOG K370
相關PDF資料
PDF描述
Q62703-Q3399 Mini TOPLED
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Q62703-Q3477 Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Flexible Termination; Unmarked
Q62703-Q3478 Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 1000pF; Working Voltage (Vdc)[max]: 50V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Flexible Termination; Unmarked
Q62703-Q3479 Hyper ARGUS LED Hyper-Bright, 3 mm T1 LED, Non Diffused
相關代理商/技術參數
參數描述
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