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參數資料
| 型號： | Q62703-Q3879 |
| 廠商： | SIEMENS AG |
| 英文描述： | TOPLED Bright Green Die |
| 中文描述： | TOPLED亮綠模具 |
| 文件頁數： | 3/8頁 |
| 文件大小： | 552K |
| 代理商： | Q62703-Q3879 |
Semiconductor Group
3
Grenzwerte
2)
Maximum Ratings
2)
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LS, LO, LG
LP
Betriebstemperatur
Operating temperature range
T
op
– 55 ... + 100
– 55 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
– 55 ... + 100
– 55 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
+ 100
C
Durchlastrom
Forward current
I
F
40
30
mA
Stostrom
Surge current
t
≤
10
μ
s, D = 0.005
Verlustleistung
Power dissipation
T
A
≤
25
°
C
Wrmewiderstand
Thermal resistance
Sperrschicht / Luft
Junction / air
I
FM
0.5
0.5
A
P
tot
140
100
mW
R
th JA
400
400
K/W
2)
Die angegebenen Grenzdaten gelten für den Chip, für den sie angegeben sind, unabhngig vom
Betriebszustand des anderen.
2)
The stated maximum ratings refer to the specified chip regardless of the other one’s operating status.
LSG K370, LSP K370, LOP K370, LOG K370
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| Q62703-Q3880 | Surface Mount Ceramic Chip Capacitors / FT-CAP / Flexible Terminations; Capacitance [nom]: 0.22uF; Working Voltage (Vdc)[max]: 25V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R; Lead Style: Surface Mount Chip; Lead Dimensions: 1206; Termination: Tin (Sn) Plated Nickel Barrier; Body Dimensions: 0.126" x 0.063"; Container: Bulk; Features: Flexible Termination; Unmarked |
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