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參數資料
| 型號： | QB8-104-30-D-50-N |
| 廠商： | SAMTEC INC |
| 元件分類： | 連接器件 |
| 英文描述： | INTERCONNECTION DEVICE |
| 文件頁數： | 1/1頁 |
| 文件大小： | 103K |
| 代理商： | QB8-104-30-D-50-N |
WWW.SAMTEC.COM
SAMTEC USA Tel: 1-800-SAMTEC-9 or 812-944-6733 Fax: 812-948-5047
SAMTEC UK Tel: 01236 739292 Fax: 01236 727113
SAMTEC GERMANY Tel: +49 (0) 89 / 89460-0 Fax: +49 (0) 89 / 89460-299
SAMTEC FRANCE Tel: 01 60 95 06 60 Fax: 01 60 95 06 61
SAMTEC ITALY Tel: 39 039 6890337 Fax: 39 039 6890315
SAMTEC ASIA PACIFIC Tel: 65 6745-5955 Fax: 65 6841-1502
SAMTEC CHINA Tel: 86-21-5385-4089 Fax: 86-21-5385-4047
SAMTEC JAPAN Tel: 81-424-42-8318 Fax: 81-424-42-8319
SAMTEC TAIWAN Tel: 886-02-2364-6077 Fax: 886-02-2367-9531
SAMTEC HONG KONG Tel: 852-26904858 Fax: 852-26904842
SAMTEC ANZ Tel: 613 9512 7747 Fax: 613 9512 7745
Due to technical progress, all designs, specifications and components are subject to change without notice.
F-203
HIGH SPEED JUMP CARD QB8 SERIES
STACK
HEIGHT
QB8
NO. OF PINS
PER ROW
–026, –052, –078, –104
(52 total pins per bank)
Note: Some sizes, styles and
options are non-standard,
non-returnable.
Mates with:
QUP8
SPECIFICATIONS
–19
–30
STACK
HEIGHT
A
(4,90)
.193
(15,90)
.626
B
(14,50)
.571
(25,50)
1.00
For complete specifications
see www.samtec.com?QB8
Conductor:
Copper
Contact Area:
Hard Gold Plated
30
" (0,76m)
Insulator:
PBT
Impedance Mismatch:
50
± 10%
APPLICATION
050
TM
QUP8
QB8
19mm
or
30mm
No. of Banks x (24,80) .976 + (11,00) .433
(0,80)
.0315
(8,00)
.315
(4,80)
.189
A
B
MICRO
RUGGED
TM
DIVISION
INTEGRITY
SIGNAL
Contact Samtec
Signal Integrity Group
for test data
D
N
–19, –30
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