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參數(shù)資料
型號(hào): RF2643
廠商: RF MICRO DEVICES INC
元件分類: 無(wú)繩電話/電話
英文描述: 3V DUAL-BAND UPCONVERTER AND DRIVER AMPLIFIER
中文描述: TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC16
封裝: 4 X 4 MM, ROHS COMPLIANT, QFN-16
文件頁(yè)數(shù): 1/16頁(yè)
文件大?。?/td> 375K
代理商: RF2643
6-37
6
M
Preliminary
Produc t Desc ription
Ordering Information
Typic al Applic ations
Features
Func tional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs HBT
Si Bi-CMOS
SiGe HBT
GaAs MESFET
Si CMOS
19
S
18
C
17
C
16
C
14
CELL OUT
13
VGC
12
PCS OUT
10
P
P
9
8
V
7
V
5
IF-
4
IF+
3
BYPASS
2
LO
1
PD
Logic
B
*
*
*
*
*
Represents "GND".
20
C
M
P
M
6
11
PCS
ATT GND
15
CELL
ATT GND
RF2643
3V DUAL-BAND UPCONVER T ER
AND DRIVE R AMPLIFIER
TDMA/AMPS Cellular Systems
CDMA/AMPS Cellular Systems
PCS Systems
Portable Battery-Powered Equipment
The RF2643 is a complete upconverter, dual-power
amplifier driver and attenuator designed for Cellular and
PCS systems. It is designed to upconverter and amplifies
RF signals while providing 22dB of linear gain control
range. It features digital control for the mixer and drivers.
The device features balanced IF inputs, single-ended LO
input and dual RF output for Cellular and PCS Systems
respectively. The IC is manufactured on an advanced Sili-
con Bi-CMOS process and packaged in a 20-pin,
4mmx4mm, leadless chip carrier with an exposed die
flag.
Single Supply 3.0V Operation
Power Down Control
Gain Control Range of 22dB
Driver Amplifier Select Pin (RF Output
Select)
High Linearity in Mixer and Driver Amp
RF2643
RF2643 PCBA
3V Dual-Band Upconverter and Driver Amplifier
Fully Assembled Evaluation Board
6
Rev A1 010717
1.00
0.90
4.00
sq.
0.60
0.24 typ
3
0.20
0.75
0.50
0.23
0.13
4 PLCS
0.50
2.10
sq.
0.65
4 PLCS
0.05
12°
MAX
Dimensions in mm.
Note orientation of package.
NOTES:
Shaded lead is Pin 1.
1
Package Warpage: 0.05 mm max.
Die Thickness Allowable: 0.305 mm max.
4
5
Pin 1 identifier must exist on top surface of package by identification
mark or feature on the package body. Exact shape and size is optional.
2
Dimension applies to plated terminal: to be measured between 0.02 mm
and 0.25 mm from terminal end.
3
Package S tyle: LCC , 20-Pin, 4 x 4
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