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參數(shù)資料
| 型號(hào)： | RSEB |
| 廠商： | Raltron Electronics Corporation |
| 英文描述： | SURFACE MOUNT TUNING FORK CRYSTAL UNIT |
| 中文描述： | 表面貼裝音叉型晶體單元 |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 47K |
| 代理商： | RSEB |
Raltron Electronics Corporation 10651 NW 19th St. Miami, Florida 33172 U.S.A.
Tel: 305-593-6033 Fax: 305-594-3973 e-mail: sales@raltron.com Internet: http://www.raltron.com
PIN 4
PIN 3
PIN 2
PIN 1
MARKING
0.6
.024
5.5
.217
0.6
.024
0.7
.028
SOLDER PAD LAYOUT
4.8
.189
.0.7
0
.
1
.
1
.
1.4
.055
1.4
.055
2
.
PIN 4
PIN 3
PIN 2
PIN 1
LEAD CONNECTION "C"
PIN 4
PIN 3
PIN 2
PIN 1
LEAD CONNECTION "D"
3
.
8.7
.343
SURFACE MOUNT TUNING FORK CRYSTAL UNIT
0
-10
25
60
TEMP
(°C)
f/fo
(ppm)
-50
330mm REEL DIAMETER
16mm TAPE WIDTH, 8mm PITCH
QUANTITY: RSE A OR B 2000 PIECES PER REEL
RSE C OR D 3000 PIECES PER REEL
SERIES RSE A, B, C, D
RSE A, B
RSE C, D
HOLDER
TYPE
-
FREQUENCY
-
LOAD
CAPACITANCE
-
CIRCUIT
TYPE
-
TAPE AND REEL
RSE
IN KHz
6 OR 12.5 pF
A
B
C
D
T
R
EXAMPLE: RSE-32.768-12.5-B-T
R
FEATURES
SUITABLE FOR TIME OF DAY CLOCK APPLICATIONS
LOW FREQUENCY RANGE
EXCELLENT FOR AUTOMATIC AND HIGH DENSITY SURFACE MOUNTING
SPECIFICATIONS
NOMINAL FREQUENCY
OUTLINE DRAWINGS
PACKAGING
REFLOW SOLDERING PROFILE
FREQUENCY VS. TEMPERATURE CURVE
PART NUMBERING SYSTEM
CARRIER TAPE DIMENSIONS
32.768 KHz
24.00 TO 350.00 KHz
351.00 KHz TO 615.00 KHz
FREQUENCY TOLERANCE
±20 PPM MAXIMUM (±50 PPM AND ±100 PPM AVAILABLE)
TURNOVER TEMPERATURE
±25°C ±5°C
±25°C ±8°C
±25°C ±15°C
TEMPERATURE COEFFICIENT
(-0.035 ± 0.
00
8) PPM/
°
C2
LOAD CAPACITANCE
6.0 TO 12.5 pF
EQUIVALENT SERIES
RESISTANCE (ESR)
50 K OHM MAXIMUM
50 K OHM MAXIMUM
20 K OHM MAXIMUM
DRIVE LEVEL
1.0 μW MAXIMUM
SHUNT CAPACITANCE
1.0 pF TYPICAL
0.95 pF TYPICAL
0.9 pF TYPICAL
AGING (FIRST YEAR)
±5 PPM MAXIMUM
OPERATING TEMPERATURE
RANGE
-40°C TO +85°C
STORAGE TEMPERATURE
RANGE
-55°C TO +125°C
SHOCK RESISTANCE
±5 PPM MAXIMUM 75 cm DROP TEST IN 3 AXES ONTO A HARD SURFACE OR
3000 g x 0.3 ms x SINEWAVE IN 3 AXES
SOLDER REFLOW CONDITIONS
230 °C MAXIMUM FOR 20 s MAXIMUM
PIN 4
PIN 3
PIN 2
PIN 1
10.41
9.40
.370
0
.
0
.
2.7
.106
5.0
.197
2.7
.106
SOLDER PAD LAYOUT
PIN 4
PIN 3
PIN 2
PIN 1
LEAD CONNECTION “A”
LEAD CONNECTION “B”
PIN 4
PIN 3
PIN 2
PIN 1
0.51
.020
2.29
0.51
.020
3
.
2.54
.100
2.54
MARKING
4
.
1
.
3
Scale none Dimension in inch
PREHEATING
REFLOW
COOLING
230 °C
150 °C
25 °C
30 - 40 s
TIME (SECONDS)
T
15 - 20 s
1.5 DIA
.06 DIA
.16 ± .004
4.0 ± 0.1
1
.
1
.
7
.
4.3 ± 0.1
.170 ± .004
8.0 ± 0.1
.315 ± .004
2.0 ± 0.05
.079 ± .002
H
CAVITY HEIGHT "H"
RSE "A AND B" = 4.0 mm/.157 in
RSE "C AND D" = 3.0 mm/.118 in
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