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參數資料
| 型號： | S29GL032M10BAIR42 |
| 廠商： | SPANSION LLC |
| 元件分類： | PROM |
| 英文描述： | Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature |
| 中文描述： | 2M X 16 FLASH 3V PROM, 100 ns, PBGA48 |
| 封裝： | 8 X 9 MM, FBGA-48 |
| 文件頁數： | 16/116頁 |
| 文件大小： | 6024K |
| 代理商： | S29GL032M10BAIR42 |
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110
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B8 February 7, 2007
Data
Sheet
Revision Summary
Revision A (January 29, 2004)
Initial Release.
Revision A1 (February 23, 2004)
Connection Diagrams
Removed 80-ball Fine-pitch BGA pinout.
Ordering Information
Added additional packing type.
Removed frame description from package material set.
Updated valid combinations to reflect the addition of new package type.
Added marking descriptions to all valid combination tables.
Word Program Command Sequence and Unlock Bypass
Command Sequence
Added these sections.
Updated figure.
Updated table.
Added note 19.
Updated table.
Added note 17.
Updated figure.
Erase and Program Operations and Alternate CE# Controlled
Erase and Program Operations
Updated TWHWHI description
Added Note 4.
Timings, Toggle Bit Timings (During Embedded Algorithms),
Alternate CE# Controlled Write (Erase/
Program) Operation Timings figures
Updated figures.
Physical Dimensions
Removed BGA-63P-M02 and BGA-80P-M01. Added the TS040 package
相關PDF資料 |
PDF描述 |
|---|---|
| S29GL032M10BAIR43 | MirrorBit Flash Family |
| S29GL032M10BFIR42 | MirrorBit Flash Family |
| S29GL032M10BFIR32 | T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination |
| S29GL032M10BFIR40 | MirrorBit Flash Family |
| S29GL032M10TAIR00 | MirrorBit Flash Family |
相關代理商/技術參數 |
參數描述 |
|---|---|
| S29GL032M10BAIR43 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology |
| S29GL032M10BAIR50 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR52 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR53 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
| S29GL032M10BAIR60 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:MirrorBit Flash Family |
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