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參數(shù)資料
型號: S29GL032M10FFIR43
廠商: SPANSION LLC
元件分類: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA64
封裝: 13 X 11 MM, LEAD FREE, FORTIFIED, BGA-64
文件頁數(shù): 28/116頁
文件大小: 6024K
代理商: S29GL032M10FFIR43
February 7, 2007 S29GL-M_00_B8
S29GL-M MirrorBitTM Flash Family
17
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
Table 1. S29GL032M Ordering Options
S29GL032M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
TS040 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (2, 3, 5)
TSOP
FAC,FFC
LAA064 (4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
FAC,FFC
LAA064 (4)
Fortified BGA
90, 10, 11
TAI,TFI
R0
TS040 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (2, 3, 5)
TSOP
FAI,FFI
LAA064 (4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
FAI,FFI
LAA064 (4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (3, 6)
TSOP
相關(guān)PDF資料
PDF描述
S29GL032M10BAIR30 MirrorBit Flash Family
S29GL032M10BAIR32 MirrorBit Flash Family
S29GL032M10BAIR33 MirrorBit Flash Family
S29GL032M10BAIR40 MirrorBit Flash Family
S29GL032M10BAIR42 Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature
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