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參數資料
| 型號： | S587-10-357-09-005437 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA357, IC SOCKET |
| 文件頁數： | 1/2頁 |
| 文件大小： | 533K |
| 代理商： | S587-10-357-09-005437 |
MILL-MAX
BGA ADAPTER / SOCKET SYSTEMS
Mill-Max BGA systems consist of two parts: the male pluggable adapter, and the ultra low
insertion force surface mount socket. By soldering the BGA package to the top of the male
adapter and surface mounting the socket to the PCB, a mating pair is created that affords
greater design flexibility. A pry-bar tool (part # 828-01-010) is available for extraction.
All pins and sockets utilized in Mill-Max BGA systems are precision machined brass and
plated gold. Press-fit into every mating socket is a beryllium copper multi-finger contact
renowned for its compliancy and reliability.
For additional information on these or any other Mill-Max interconnect component, contact
our applications engineers at (516) 922-6000.
Mill-Max adapter and socket systems are gaining
in popularity as applications for socketing BGA
devices continue to grow. Typically used in ASIC
and CPU development, these modules convert a
BGA package to a pluggable device, thus allowing
for removal from the mating surface mount socket
without damage to the host PC board.
BGA DEVICE
SOCKET
ADAPTER
The insulators for both parts are FR-4 epoxy
which has TCE to match the BGA device and
circuit board.
BGA sytems are designed to
accept high pin count packages typically on
.050" grid, but other grid spacings (down to
1mm) can be made to order. Mill-Max offers the
option of having the solder surfaces pre-tinned.
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