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參數資料
型號: S9269
元件分類: 光敏二極管
英文描述: PHOTO DIODE
封裝: 10.10 X 8.90 MM, 40 MM HEIGHT, CERAMIC PACKAGE-4
文件頁數: 3/3頁
文件大小: 113K
代理商: S9269
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184, http://www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 2004 Hamamatsu Photonics K.K.
Si photodioe with preamp
S9269, S9270
Cat. No. KSPD1066E01
Dec. 2004 DN
s Dimensional outlines (unit: mm, tolerance unless otherwise noted: ±0.2)
S9269
S9270
KSPDA0160EA
KSPDA0161EA
10.1 ± 0.1
(CERAMIC)
(4 ×) 0.45
Cu-Zn ALLOY
(4 ×)( 1.0)
8.9
±
0.1
(CERAMIC)
0.75
2.0
±
0.1
(2.0)
(5.0)
1.7
ACTIVE AREA
(5.83 × 5.83)
CERAMIC
PHOTOSENSITIVE
SURFACE
PWB
SOLDER
Active area position accuracy
versus package center
-0.165
≤ X ≤ +0.335
-0.25
≤ Y ≤ +0.25
GND
Vcc-
OUT
Vcc+
1.0
MAX.
5.7
1.8
7.4 ± 0.1
7.62
8.0
4.0
1.5
2.54
±
0.1
2.54
±
0.1
8.8
(PWB)
10.0 (PWB)
Y
X
16.5 ± 0.2
(CERAMIC)
Y
X
12.7
13.8
14.8
(PWB)
5.08
±
0.1
5.08
±
0.1
12.5
1.0
MAX.
1.7
0.9
2.15
±
0.1
(2.0)
(5.0)
(4 ×) 0.45
Cu-Zn ALLOY
(4 ×)( 1.0)
15.0
±
0.15
(CERAMIC)
ACTIVE AREA
(10 × 10)
PHOTOSENSITIVE
SURFACE
CERAMIC
PWB
SOLDER
10.8
2.25
0.5
2.75
12.5 ± 0.2
16.3 (PWB)
Active area position accuracy
versus package center
-0.3
≤ X, Y ≤ +0.3
GND
Vcc-
OUT
Vcc+
q ESD
S9269, S9270 may be damaged or their performance may deteriorate by such factors as electro static discharge from the
human body, surge voltages from measurement equipment, leakage voltages from soldering irons and packing materials,
etc. As a countermeasure against electro static discharge, the device, operator, work place and measuring jigs must all be set
at the same potential. The following precautions must be observed during use:
To protect the device from electro static discharge which accumulate on the operator or the operator's clothes, use a wrist
strap or similar tools to ground the operator's body via a high impedance resistor (1 M
).
A semiconductive sheet (1 M
to 100 M) should be laid on both the work table and the floor in the work area.
When soldering, use an electrically grounded soldering iron with an isolation resistance of more than 10 M
.
For containers and packing, use of a conductive material or aluminum foil is effective. When using an antistatic material, use
one with a resistance of 0.1 M
/cm2 to 1 G/cm2.
q Wiring
If electric current or voltage is applied in reverse polarity to an electronic device such as a preamplifier, this can degrade
device performance or destroy the device. Always check the wiring and dimensional outline to avoid misconnection.
Precautions for use
3
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