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參數資料
| 型號： | SA56004HD,118 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 36/43頁 |
| 文件大小： | 516K |
| 描述： | IC TEMP SENSOR DIGITAL 8SOIC |
| 標準包裝： | 2,500 |
| 功能： | 溫度監控系統（傳感器） |
| 傳感器類型： | 內部和外部 |
| 感應溫度： | -40°C ~ 125°C |
| 精確度： | ±3°C（最小值） |
| 拓撲： | ADC（三角積分型），多路復用器，寄存器庫 |
| 輸出類型： | I²C?/SMBus? |
| 輸出警報： | 是 |
| 輸出風扇： | 是 |
| 電源電壓： | 3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應商設備封裝： | 8-SO |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | 935274554118 SA56004HD-T SA56004HD-T-ND |
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SA56004X
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 7 25 February 2013
36 of 43
NXP Semiconductors
SA56004X
Digital temperature sensor with overtemperature alarms
13.4 Reflow soldering
Key characteristics in reflow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 24
) than a SnPb process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 22
and 23
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 24
.
Table 22. SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
?SPAN class="pst SA56004HD-118_2299608_10"> 350
< 2.5
235
220
?2.5
220
220
Table 23. Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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相關代理商/技術參數 |
參數描述 |
|---|---|
| SA56004HDP | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1 Degrees Celcious accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with over temperature alarms |
| SA56004HDP,118 | 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| SA56004HDP-T | 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| SA56004HD-T | 功能描述:板上安裝溫度傳感器 I2C LOC +/- 2OC AND REM +/- 1OC TS RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關閉: 安裝風格: 封裝 / 箱體: 設備功能:Temperature and Humidity Sensor |
| SA56004X | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1 Degrees Celcious accurate, SMBus-compatible, 8-pin, remote/local digital temperature sensor with over temperature alarms |
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