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參數資料
| 型號： | SB80C188EC13 |
| 英文描述： | MICROPROCESSOR|16-BIT|CMOS|QFP|100PIN|PLASTIC |
| 中文描述： | 微處理器| 16位|的CMOS | QFP封裝| 100引腳|塑料 |
| 文件頁數： | 25/57頁 |
| 文件大小： | 585K |
| 代理商： | SB80C188EC13 |
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80C186EC/188EC, 80L186EC/188EC
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Storage Temperature àààààààààà
b
65
§
C to
a
150
§
C
Case Temperature Under Biasààà
b
65
§
C to
a
100
§
C
Supply Voltage
with Respect to V
SS
ààààààààààà
b
0.5V to
a
6.5V
Voltage on Other Pins
with Respect to V
SS
àààààà
b
0.5V to V
CC
a
0.5V
NOTICE: This data sheet contains preliminary infor-
mation on new products in production. The specifica-
tions are subject to change without notice. Verify with
your local Intel Sales office that you have the latest
data sheet before finalizing a design.
*
WARNING: Stressing the device beyond the ‘‘Absolute
Maximum Ratings’’ may cause permanent damage.
These are stress ratings only. Operation beyond the
‘‘Operating Conditions’’ is not recommended and ex-
tended exposure beyond the ‘‘Operating Conditions’’
may affect device reliability.
Recommended Connections
Power and ground connections must be made to
multiple V
CC
and V
SS
pins. Every 80C186EC-based
circuit board should include separate power (V
CC
)
and ground (V
SS
) planes. Every V
CC
pin must be
connected to the power plane, and every V
SS
pin
must be connected to the ground plane. Liberal de-
coupling capacitance should be placed near the
processor. The processor can cause transient pow-
er surges when its output buffers transition, particu-
larly when connected to large capacitive loads.
Low inductance capacitors and interconnects are
recommended for best high frequency electrical per-
formance. Inductance is reduced by placing the de-
coupling capacitors as close as possible to the proc-
essor V
CC
and V
SS
package pins.
Always connect any unused input to an appropriate
signal level. In particular, unused interrupt inputs
(NMI, INT0:7) should be connected to V
SS
through a
pull-down resistor. Leave any unused output pin un-
connected.
25
相關PDF資料 |
PDF描述 |
|---|---|
| SB80C188EC-13 | 16-Bit Microprocessor |
| SB80C188EC20 | MICROPROCESSOR|16-BIT|CMOS|QFP|100PIN|PLASTIC |
| SB80C188EC-20 | 16-Bit Microprocessor |
| SB80C188EC-25 | 16-Bit Microprocessor |
| SB80L186EC13 | MICROPROCESSOR|16-BIT|CMOS|QFP|100PIN|PLASTIC |
相關代理商/技術參數 |
參數描述 |
|---|---|
| SB80C188EC-13 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microprocessor |
| SB80C188EC16 | 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS |
| SB80C188EC20 | 功能描述:IC MPU 16-BIT 5V 20MHZ 100-SQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA（25x25） 包裝:托盤 |
| SB80C188EC-20 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:16-Bit Microprocessor |
| SB80C188EC25 | 功能描述:IC MPU 16-BIT 5V 25MHZ 100-SQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:- 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應商設備封裝:357-PBGA（25x25） 包裝:托盤 |
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